公开(公告)号：US08030743B2

公开(公告)日：2011-10-04

申请号：US11970087

申请日：2008-01-07

申请人： Yong Liu ,  Margie T. Rios ,  Hua Yang ,  Yumin Liu ,  Tiburcio A. Maldo

发明人： Yong Liu ,  Margie T. Rios ,  Hua Yang ,  Yumin Liu ,  Tiburcio A. Maldo

IPC分类号： H01L23/495

CPC分类号： H01L23/49537 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/27 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L25/16 ,  H01L2224/27436 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A two tier power module has, in one form thereof, a PC board having upper and lower traces with an opening in the insulating material that contains a power device which has upward extending solder bump connections. An upper leadframe is mounted on the solder bumps and the upper tracks of the PC board. Vias in the PC board connect selected upper and lower traces. A control device is mounted atop the leadframe and wire bonded to the leadframe, and the assembly is encapsulated leaving exposed the bottom surfaces of the lower traces of the PC board as external connections. In another form the PC board is replaced by a planar leadframe and the upper leadframe has stepped sections which make connections with the planar leadframe, the bottom surfaces of the planar leadframe forming external connections of the module.

摘要翻译： 两层电源模块的一种形式是具有上和下迹线的PC板，绝缘材料中具有开口，该开口包含具有向上延伸的焊料凸点连接的功率器件。 上引线框架安装在焊盘和PC板的上轨道上。 PC板上的通孔连接选定的上下轨迹。 控制装置安装在引线框架顶部，引线框架连接在一起，组件被封装，从而将PC板的下部走线的底面暴露为外部连接。 在另一种形式中，PC板由平面引线框架代替，并且上引线框架具有与平面引线框架连接的阶梯部分，平面引线框架的底表面形成模块的外部连接。

公开(公告)号：US20110070699A1

公开(公告)日：2011-03-24

申请号：US12886614

申请日：2010-09-21

申请人： Yong Liu ,  Yumin Liu ,  Hua Yang ,  Tiburcio A. Maldo ,  Margie T. Rios

发明人： Yong Liu ,  Yumin Liu ,  Hua Yang ,  Tiburcio A. Maldo ,  Margie T. Rios

IPC分类号： H01L21/60

CPC分类号： H01L25/18 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A 3D smart power module for power control, such as a three phase power control module, includes a two sided printed circuit (PC) board with power semiconductor devices attached to one side and control semiconductor devices attached to the other side. The power semiconductor devices are die bonded to a direct bonded copper substrate which has a bottom surface exposed in the molded package. In one embodiment the module has 27 external connectors attached to one side of the PC board and arranged in the form of a ball grid array.

摘要翻译： 用于功率控制的3D智能功率模块，例如三相电源控制模块，包括一个双面印刷电路（PC）板，其功率半导体器件连接到一侧并控制连接到另一侧的半导体器件。 功率半导体器件被封装在直接接合的铜基底上，该基底具有在模制封装中暴露的底部表面。 在一个实施例中，该模块具有连接到PC板一侧的27个外部连接器，并以球栅阵列的形式布置。

公开(公告)号：US20090200657A1

公开(公告)日：2009-08-13

申请号：US12028051

申请日：2008-02-08

申请人： Yong Liu ,  Yumin Liu ,  Hua Yang ,  Tiburcio A. Maldo ,  Margie T. Rios

发明人： Yong Liu ,  Yumin Liu ,  Hua Yang ,  Tiburcio A. Maldo ,  Margie T. Rios

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L25/18 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A 3D smart power module for power control, such as a three phase power control module, includes a two sided printed circuit (PC) board with power semiconductor devices attached to one side and control semiconductor devices attached to the other side. The power semiconductor devices are die bonded to a direct bonded copper substrate which has a bottom surface exposed in the molded package. In one embodiment the module has 27 external connectors attached to one side of the PC board and arranged in the form of a ball grid array.

摘要翻译： 用于功率控制的3D智能功率模块，例如三相电源控制模块，包括一个双面印刷电路（PC）板，其功率半导体器件连接到一侧并控制连接到另一侧的半导体器件。 功率半导体器件被封装在直接接合的铜基底上，该基底具有在模制封装中暴露的底部表面。 在一个实施例中，该模块具有连接到PC板一侧的27个外部连接器，并以球栅阵列的形式布置。

公开(公告)号：US20090174046A1

公开(公告)日：2009-07-09

申请号：US11970087

申请日：2008-01-07

申请人： Yong Liu ,  Margie T. Rios ,  Hua Yang ,  Yumin Liu ,  Tiburcio A. Maldo

发明人： Yong Liu ,  Margie T. Rios ,  Hua Yang ,  Yumin Liu ,  Tiburcio A. Maldo

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49537 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/27 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L25/16 ,  H01L2224/27436 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A two tier power module has, in one form thereof, a PC board having upper and lower traces with an opening in the insulating material that contains a power device which has upward extending solder bump connections. An upper leadframe is mounted on the solder bumps and the upper tracks of the PC board. Vias in the PC board connect selected upper and lower traces. A control device is mounted atop the leadframe and wire bonded to the leadframe, and the assembly is encapsulated leaving exposed the bottom surfaces of the lower traces of the PC board as external connections. In another form the PC board is replaced by a planar leadframe and the upper leadframe has stepped sections which make connections with the planar leadframe, the bottom surfaces of the planar leadframe forming external connections of the module.

摘要翻译： 两层电源模块的一种形式是具有上和下迹线的PC板，绝缘材料中具有开口，该开口包含具有向上延伸的焊料凸点连接的功率器件。 上引线框架安装在焊盘和PC板的上轨道上。 PC板上的通孔连接选定的上下轨迹。 控制装置安装在引线框架顶部，引线框架连接在一起，组件被封装，从而将PC板的下部走线的底面暴露为外部连接。 在另一种形式中，PC板由平面引线框架代替，并且上引线框架具有与平面引线框架连接的阶梯部分，平面引线框架的底表面形成模块的外部连接。

公开(公告)号：US20120001313A1

公开(公告)日：2012-01-05

申请号：US13227802

申请日：2011-09-08

申请人： Yong Liu ,  Margie T. Rios ,  Hua Yang ,  Yumin Liu ,  Tiburcio A. Maldo

发明人： Yong Liu ,  Margie T. Rios ,  Hua Yang ,  Yumin Liu ,  Tiburcio A. Maldo

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49537 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/27 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L25/16 ,  H01L2224/27436 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A two tier power module has, in one form thereof, a PC board having upper and lower traces with an opening in the insulating material that contains a power device which has upward extending solder bump connections. An upper leadframe is mounted on the solder bumps and the upper tracks of the PC board. Vias in the PC board connect selected upper and lower traces. A control device is mounted atop the leadframe and wire bonded to the leadframe, and the assembly is encapsulated leaving exposed the bottom surfaces of the lower traces of the PC board as external connections. In another form the PC board is replaced by a planar leadframe and the upper leadframe has stepped sections which make connections with the planar leadframe, the bottom surfaces of the planar leadframe forming external connections of the module.

摘要翻译： 两层电源模块的一种形式是具有上和下迹线的PC板，绝缘材料中具有开口，该开口包含具有向上延伸的焊料凸点连接的功率器件。 上引线框架安装在焊盘和PC板的上轨道上。 PC板上的通孔连接选定的上下轨迹。 控制装置安装在引线框架顶部，引线框架连接在一起，组件被封装，从而将PC板的下部走线的底面暴露为外部连接。 在另一种形式中，PC板由平面引线框架代替，并且上引线框架具有与平面引线框架连接的阶梯部分，平面引线框架的底表面形成模块的外部连接。

公开(公告)号：US07808101B2

公开(公告)日：2010-10-05

申请号：US12028051

申请日：2008-02-08

申请人： Yong Liu ,  Yumin Liu ,  Hua Yang ,  Tiburcio A. Maldo ,  Margie T. Rios

发明人： Yong Liu ,  Yumin Liu ,  Hua Yang ,  Tiburcio A. Maldo ,  Margie T. Rios

IPC分类号： H01L23/48 ,  H01L23/34

CPC分类号： H01L25/18 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A 3D smart power module for power control, such as a three phase power control module, includes a two sided printed circuit (PC) board with power semiconductor devices attached to one side and control semiconductor devices attached to the other side. The power semiconductor devices are die bonded to a direct bonded copper substrate which has a bottom surface exposed in the molded package. In one embodiment the module has 27 external connectors attached to one side of the PC board and arranged in the form of a ball grid array.

摘要翻译： 用于功率控制的3D智能功率模块，例如三相电源控制模块，包括一个双面印刷电路（PC）板，其功率半导体器件连接到一侧并控制连接到另一侧的半导体器件。 功率半导体器件被封装在直接接合的铜基底上，该基底具有在模制封装中暴露的底部表面。 在一个实施例中，该模块具有连接到PC板一侧的27个外部连接器，并以球栅阵列的形式布置。

公开(公告)号：US08426953B2

公开(公告)日：2013-04-23

申请号：US13227802

申请日：2011-09-08

申请人： Yong Liu ,  Margie T. Rios ,  Hua Yang ,  Yumin Liu ,  Tiburcio A. Maldo

发明人： Yong Liu ,  Margie T. Rios ,  Hua Yang ,  Yumin Liu ,  Tiburcio A. Maldo

IPC分类号： H01L23/495

CPC分类号： H01L23/49537 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/27 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L25/16 ,  H01L2224/27436 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A two tier power module has, in one form thereof, a PC board having upper and lower traces with an opening in the insulating material that contains a power device which has upward extending solder bump connections. An upper leadframe is mounted on the solder bumps and the upper tracks of the PC board. Vias in the PC board connect selected upper and lower traces. A control device is mounted atop the leadframe and wire bonded to the leadframe, and the assembly is encapsulated leaving exposed the bottom surfaces of the lower traces of the PC board as external connections. In another form the PC board is replaced by a planar leadframe and the upper leadframe has stepped sections which make connections with the planar leadframe, the bottom surfaces of the planar leadframe forming external connections of the module.

摘要翻译： 两层电源模块的一种形式是具有上和下迹线的PC板，绝缘材料中具有开口，该开口包含具有向上延伸的焊料凸点连接的功率器件。 上引线框架安装在焊盘和PC板的上轨道上。 PC板上的通孔连接选定的上下轨迹。 控制装置安装在引线框架顶部，引线框架连接在一起，组件被封装，从而将PC板的下部走线的底面暴露为外部连接。 在另一种形式中，PC板由平面引线框架代替，并且上引线框架具有与平面引线框架连接的阶梯部分，平面引线框架的底表面形成模块的外部连接。

公开(公告)号：US08088645B2

公开(公告)日：2012-01-03

申请号：US12886614

申请日：2010-09-21

申请人： Yong Liu ,  Yumin Liu ,  Hua Yang ,  Tiburcio A. Maldo ,  Margie T. Rios

发明人： Yong Liu ,  Yumin Liu ,  Hua Yang ,  Tiburcio A. Maldo ,  Margie T. Rios

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L25/18 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A 3D smart power module for power control, such as a three phase power control module, includes a two sided printed circuit (PC) board with power semiconductor devices attached to one side and control semiconductor devices attached to the other side. The power semiconductor devices are die bonded to a direct bonded copper substrate which has a bottom surface exposed in the molded package. In one embodiment the module has 27 external connectors attached to one side of the PC board and arranged in the form of a ball grid array.

摘要翻译： 用于功率控制的3D智能功率模块，例如三相电源控制模块，包括一个双面印刷电路（PC）板，其功率半导体器件连接到一侧并控制连接到另一侧的半导体器件。 功率半导体器件被封装在直接接合的铜基底上，该基底具有在模制封装中暴露的底部表面。 在一个实施例中，该模块具有连接到PC板一侧的27个外部连接器，并以球栅阵列的形式布置。

公开(公告)号：US07952204B2

公开(公告)日：2011-05-31

申请号：US12102793

申请日：2008-04-14

申请人： Yumin Liu ,  Hua Yang ,  Yong Liu ,  Tiburcio A. Maldo

发明人： Yumin Liu ,  Hua Yang ,  Yong Liu ,  Tiburcio A. Maldo

IPC分类号： H01L23/538 ,  H01L21/60 ,  H01L23/488 ,  H01L23/48 ,  H01L23/34

CPC分类号： H01L23/5385 ,  H01L25/162 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/0306 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/10318 ,  H05K2203/1572 ,  H01L2924/00 ,  H01L2224/05599

摘要： An exemplary semiconductor die package is disclosed having one or more semiconductor dice disposed on a first substrate, one or more packaged electrical components disposed on a second substrate that is electrical coupled to the first substrate, and an electrically insulating material disposed over portions of the substrates. The first substrate may hold power-handling devices and may be specially constructed to dissipation heat and to facilitate fast and inexpensive manufacturing. The second substrate may hold packaged components of control circuitry for the power-handling devices, and may be specially constructed to enable fast and inexpensive wiring design and fast and inexpensive component assembly. The first substrate may be used with different designs of the second substrate.

摘要翻译： 公开了一种示例性的半导体管芯封装，其具有设置在第一衬底上的一个或多个半导体管芯，设置在电耦合到第一衬底的第二衬底上的一个或多个封装的电气部件，以及设置在衬底部分上的电绝缘材料 。 第一基板可以保持动力处理装置，并且可以被特别构造以散热并促进快速和便宜的制造。 第二基板可以保持用于功率处理装置的控制电路的封装部件，并且可以被特别构造以实现快速和便宜的布线设计以及快速和便宜的部件组装。 第一衬底可以与第二衬底的不同设计一起使用。

公开(公告)号：US20090194857A1

公开(公告)日：2009-08-06

申请号：US12024847

申请日：2008-02-01

申请人： Yong Liu ,  Yumin Liu ,  Hua Yang ,  Tiburcio A. Maldo

发明人： Yong Liu ,  Yumin Liu ,  Hua Yang ,  Tiburcio A. Maldo

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L23/3735 ,  H01L23/49816 ,  H01L23/49844 ,  H01L23/5385 ,  H01L2224/48091 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed are semiconductor die packages, methods of making them, and systems incorporating them. An exemplary package comprises a first substrate, a second substrate, a semiconductor die disposed between the first and second substrates, and an electrically conductive member disposed between the first and second substrates. The semiconductor die has a conductive region at its first surface that is electrically coupled to a first conductive region of the first substrate, and another conductive region at its second surface that is electrically coupled to a first conductive region of the second substrate. The conductive member is electrically coupled between the first conductive region of the second substrate and a second electrically conductive region of the first substrate. This configuration enables terminals on both surfaces of the semiconductor die to be coupled to the first substrate.

摘要翻译： 公开了半导体管芯封装，制造方法以及结合它们的系统。 示例性封装包括第一衬底，第二衬底，设置在第一和第二衬底之间的半导体管芯，以及设置在第一和第二衬底之间的导电构件。 半导体管芯在其第一表面处具有电耦合到第一衬底的第一导电区域的导电区域，以及在其第二表面处的电耦合到第二衬底的第一导电区域的另一导电区域。 导电构件电耦合在第二基板的第一导电区域和第一基板的第二导电区域之间。 这种配置使得半导体管芯的两个表面上的端子能够耦合到第一基板。