发明授权
US08426977B2 Semiconductor apparatus, manufacturing method of semiconductor apparatus, and camera module
失效
半导体装置，半导体装置的制造方法以及相机模块
- 专利标题： Semiconductor apparatus, manufacturing method of semiconductor apparatus, and camera module
- 专利标题（中）： 半导体装置，半导体装置的制造方法以及相机模块
-
申请号： US12539037申请日： 2009-08-11
-
公开(公告)号： US08426977B2公开(公告)日： 2013-04-23
- 发明人: Kazumasa Tanida , Hideko Mukaida , Susumu Harada , Chiaki Takubo
- 申请人： Kazumasa Tanida , Hideko Mukaida , Susumu Harada , Chiaki Takubo
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Tokyo
- 代理机构： Turocy & Watson, LLP
- 优先权： JP2008-207830 20080812
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A semiconductor apparatus includes, a semiconductor substrate having first and second main surfaces and a through hole connecting the first and second main surfaces; a first insulation layer arranged on the first main surface, and having an opening corresponding to the through hole; a first conductive layer arranged on the first insulation layer, and covering the through hole; a second insulation layer arranged on an inner wall of the through hole and the second surface; a second conductive layer arranged in the through hole and on the second insulation layer, the second conductive layer contacting the first conductive layer; and a filling member arranged on the second conductive layer in the through hole, and having a gap between the second conductive layer on the first main surface side.
公开/授权文献
信息查询
IPC分类:
