发明授权
- 专利标题： Composite layered chip package
- 专利标题（中）： 复合分层芯片封装
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申请号： US13240048申请日： 2011-09-22
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公开(公告)号： US08426981B2公开(公告)日： 2013-04-23
- 发明人: Yoshitaka Sasaki , Hiroyuki Ito , Atsushi Iijima
- 申请人： Yoshitaka Sasaki , Hiroyuki Ito , Atsushi Iijima
- 申请人地址： US CA Milpitas CN Hong Kong
- 专利权人： Headway Technologies, Inc.,SAE Magnetics (H.K.) Ltd.
- 当前专利权人： Headway Technologies, Inc.,SAE Magnetics (H.K.) Ltd.
- 当前专利权人地址： US CA Milpitas CN Hong Kong
- 代理机构： Oliff & Berridge, PLC
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/02 ; H01L23/52 ; H01L29/40
摘要：
A composite layered chip package includes first and second subpackages that are stacked. Each subpackage includes a main body and wiring. The main body includes: a main part having a top surface and a bottom surface; first terminals disposed on the top surface of the main part; and second terminals disposed on the bottom surface of the main part. The first and second terminals are electrically connected to the wiring. The first and second subpackages are arranged in a specific relative positional relationship, different from a reference relative positional relationship, with each other.
公开/授权文献
- US20130075935A1 COMPOSITE LAYERED CHIP PACKAGE 公开/授权日：2013-03-28
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