Invention Grant
- Patent Title: Method for fabricating a p-type semiconductor structure
- Patent Title (中): 制造p型半导体结构的方法
-
Application No.: US11841116Application Date: 2007-08-20
-
Publication No.: US08431936B2Publication Date: 2013-04-30
- Inventor: Fengyi Jiang , Li Wang , Wenqing Fang , Chunlan Mo
- Applicant: Fengyi Jiang , Li Wang , Wenqing Fang , Chunlan Mo
- Applicant Address: CN Nanchang
- Assignee: Lattice Power (Jiangxi) Corporation
- Current Assignee: Lattice Power (Jiangxi) Corporation
- Current Assignee Address: CN Nanchang
- Agency: Park, Vaughan, Fleming & Dowler LLP
- Agent Shun Yao
- Priority: CN200710112585 20070622
- Main IPC: H01L29/26
- IPC: H01L29/26 ; H01L29/06

Abstract:
One embodiment of the present invention provides a method for fabricating a group III-V p-type nitride structure. The method comprises growing a first layer of p-type group III-V material with a first acceptor density in a first growing environment. The method further comprises growing a second layer of p-type group III-V material, which is thicker than the first layer and which has a second acceptor density, on top of the first layer in a second growing environment. In addition, the method comprises growing a third layer of p-type group III-V material, which is thinner than the second layer and which has a third acceptor density, on top of the second layer in a third growing environment.
Public/Granted literature
- US20080315212A1 METHOD FOR FABRICATING A P-TYPE SEMICONDUCTOR STRUCTURE Public/Granted day:2008-12-25
Information query
IPC分类: