发明授权
- 专利标题: Integrated circuit die stacks with rotationally symmetric vias
- 专利标题(中): 具有旋转对称通孔的集成电路芯片堆叠
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申请号: US12616563申请日: 2009-11-11
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公开(公告)号: US08432027B2公开(公告)日: 2013-04-30
- 发明人: Jimmy G. Foster, Sr. , Kyu-Hyoun Kim
- 申请人: Jimmy G. Foster, Sr. , Kyu-Hyoun Kim
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Biggers & Ohanian, LLP.
- 代理商 Edward J. Lenart; Cynthia G. Seal
- 主分类号: H01L23/538
- IPC分类号: H01L23/538 ; H01L23/48
摘要:
An integrated circuit die stack including a first integrated circuit die mounted upon a substrate, the first die including pass-through vias (‘PTVs’) composed of conductive pathways through the first die with no connection to any circuitry on the first die; and a second integrated circuit die, identical to the first die, rotated with respect to the first die and mounted upon the first die, with the PTVs in the first die connecting signal lines from the substrate through the first die to through silicon vias (‘TSVs’) in the second die composed of conductive pathways through the second die connected to electronic circuitry on the second die; with the TSVs and PTVs disposed upon each identical die so that the positions of the TSVs and PTVs on each identical die are rotationally symmetrical with respect to the TSVs and PTVs on the other identical die.