发明授权
- 专利标题： Solder paste mixer
- 专利标题（中）： 焊膏搅拌机
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申请号： US13207454申请日： 2011-08-11
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公开(公告)号： US08434929B2公开(公告)日： 2013-05-07
- 发明人: Yu-Ching Liu , Fu-Chi Yang , Chi-An Yu , Xi-Hang Li , Bing Liu , Jing-Bin Liang , Hai-Gui Huang , Xue-Bing Bao
- 申请人： Yu-Ching Liu , Fu-Chi Yang , Chi-An Yu , Xi-Hang Li , Bing Liu , Jing-Bin Liang , Hai-Gui Huang , Xue-Bing Bao
- 申请人地址： CN Shenzhen TW New Taipei
- 专利权人： Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人： Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址： CN Shenzhen TW New Taipei
- 代理机构： Altis Law Group, Inc.
- 优先权： CN201110047617 20110228
- 主分类号： B01F11/00
- IPC分类号： B01F11/00 ; B01F11/02
摘要：
A solder paste mixer includes a housing, a vibration mechanism, a rotating mechanism, and a fixture for fixing a solder paste jar. The housing defines a receiving space, and the vibration mechanism and the rotating mechanism are retained within the receiving space. The fixture can be vibrated by the vibration mechanism and rotated by the rotating mechanism.
公开/授权文献
- US20120218853A1 SOLDER PASTE MIXER 公开/授权日：2012-08-30
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