公开(公告)号：US08477497B2

公开(公告)日：2013-07-02

申请号：US12949783

申请日：2010-11-19

Applicant: Yu-Ching Liu ,  Chi-An Yu ,  Xi-Hang Li ,  Bing Liu ,  Bo Xu ,  Jie-Peng Kang

Inventor： Yu-Ching Liu ,  Chi-An Yu ,  Xi-Hang Li ,  Bing Liu ,  Bo Xu ,  Jie-Peng Kang

IPC: H05K7/20

CPC classification number: H05K7/20436 ,  H05K7/20445 ,  Y10T29/49002 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49352 ,  Y10T29/53113 ,  Y10T29/53274

Abstract: A cooling device for cooling electronic components includes a base plate, a power source, and a cooling module. The cooling module includes a cooling sheet and a thermal conductive base. The cooling sheet includes a hot surface and a cooling surface. The thermal conductive base is located above the cooling surface of the cooling sheet, and configured to support electronic components on a printed circuit board and transfer heat between the electronic components and the cooling surface. When the cooling sheet is powered on, the cooling surface is in a constant state of low temperature. Due to the heat transfer between the cooling surface and the thermal conductive base, heat from the electronic components can be transferred from the thermal conductive base to the cooling surface continuously.

Abstract translation: 用于冷却电子部件的冷却装置包括基板，电源和冷却模块。 冷却模块包括冷却片和导热基座。 冷却片包括热表面和冷却表面。 导热基座位于冷却片的冷却面的上方，构成为将印刷电路板上的电子部件支撑在电子部件与冷却面之间传递热量。 当冷却片通电时，冷却表面处于恒定的低温状态。 由于冷却表面和导热基底之间的热传递，来自电子部件的热量可以从导热基底连续传递到冷却表面。

公开(公告)号：US06605363B2

公开(公告)日：2003-08-12

申请号：US09836322

申请日：2001-04-18

Applicant: Chih-Wei Ho ,  Zu-Sho Chow ,  Bor-Iuan Jan ,  Jia-Huey Tsao ,  Chao-Chi Pan ,  Wen-Hsun Kuo ,  Yao-Sung Chang ,  Cheng-Tao Wu ,  Yu-Ching Liu

Inventor： Chih-Wei Ho ,  Zu-Sho Chow ,  Bor-Iuan Jan ,  Jia-Huey Tsao ,  Chao-Chi Pan ,  Wen-Hsun Kuo ,  Yao-Sung Chang ,  Cheng-Tao Wu ,  Yu-Ching Liu

IPC: B32B904

CPC classification number: B82Y30/00 ,  B01J19/0046 ,  B01J2219/00387 ,  B01J2219/00529 ,  B01J2219/00576 ,  B01J2219/00596 ,  B01J2219/00605 ,  B01J2219/00608 ,  B01J2219/0061 ,  B01J2219/00612 ,  B01J2219/00626 ,  B01J2219/00637 ,  B01J2219/00641 ,  B01J2219/00677 ,  C07B2200/11 ,  C40B60/14 ,  Y10T428/31612 ,  Y10T428/31663 ,  Y10T428/31667 ,  Y10T428/31786 ,  Y10T428/31938 ,  Y10T428/31942

Abstract: The invention features a method for preparing a high-density functional slide by coating a sol-gel containing amine-group bearing silanes and a solution containing polyaldehyde groups onto an organic or inorganic substrate, respectively. The resulting slide is useful in the preparation of highly homogeneous functional-group slides and the high-density and high-efficiency bio-chip/microarray.

公开(公告)号：US08901729B2

公开(公告)日：2014-12-02

申请号：US13490810

申请日：2012-06-07

Applicant: Chia-Yin Chen ,  Yu-Ching Liu ,  Yueh-Chiung Chang ,  Yu-Po Wang

Inventor： Chia-Yin Chen ,  Yu-Ching Liu ,  Yueh-Chiung Chang ,  Yu-Po Wang

IPC: H01L23/48

CPC classification number: H01L24/03 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/03462 ,  H01L2224/03552 ,  H01L2224/0381 ,  H01L2224/03831 ,  H01L2224/04042 ,  H01L2224/27013 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A packaging substrate and a semiconductor package using the packaging substrate are provided. The packaging substrate includes: a substrate body having a die attach area, a circuit layer formed around the die attach area and having a plurality of conductive traces each having a wire bonding pad, and a surface treatment layer formed on the wire bonding pads. Therein, only one of the conductive traces is connected to an electroplating line so as to prevent cross-talk that otherwise occurs between conductive traces due to too many electroplating lines in the prior art.

Abstract translation: 提供了使用封装基板的封装基板和半导体封装。 封装基板包括：具有管芯附着区域的基板主体，形成在管芯附着区域周围的电路层，并且具有多个导线，每个导线具有引线焊盘，以及形成在引线接合焊盘上的表面处理层。 其中，仅有一个导电迹线连接到电镀线，以便防止由于现有技术中的电镀线太多导致的导电迹线之间的串扰。

公开(公告)号：US08434929B2

公开(公告)日：2013-05-07

申请号：US13207454

申请日：2011-08-11

Applicant: Yu-Ching Liu ,  Fu-Chi Yang ,  Chi-An Yu ,  Xi-Hang Li ,  Bing Liu ,  Jing-Bin Liang ,  Hai-Gui Huang ,  Xue-Bing Bao

Inventor： Yu-Ching Liu ,  Fu-Chi Yang ,  Chi-An Yu ,  Xi-Hang Li ,  Bing Liu ,  Jing-Bin Liang ,  Hai-Gui Huang ,  Xue-Bing Bao

IPC: B01F11/00 ,  B01F11/02

CPC classification number: B01F11/0031 ,  B01F9/0014 ,  B01F9/10 ,  B01F11/0008

Abstract: A solder paste mixer includes a housing, a vibration mechanism, a rotating mechanism, and a fixture for fixing a solder paste jar. The housing defines a receiving space, and the vibration mechanism and the rotating mechanism are retained within the receiving space. The fixture can be vibrated by the vibration mechanism and rotated by the rotating mechanism.

Abstract translation: 焊膏混合器包括壳体，振动机构，旋转机构和用于固定焊膏罐的固定装置。 壳体限定接收空间，并且振动机构和旋转机构保持在接收空间内。 夹具可以通过振动机构振动并由旋转机构旋转。

公开(公告)号：US20130106746A1

公开(公告)日：2013-05-02

申请号：US13615227

申请日：2012-09-13

Applicant: Szu-Wei LAI ,  Yu-Ching LIU ,  Wan-Yu HO

Inventor： Szu-Wei LAI ,  Yu-Ching LIU ,  Wan-Yu HO

IPC: G06F3/041 ,  H05K3/28 ,  H05K3/10

CPC classification number: G06F3/0412 ,  G06F1/169 ,  G06F3/041 ,  G06F2203/04103 ,  H05K3/4685 ,  H05K2201/0326 ,  Y10T29/49155 ,  Y10T29/49162

Abstract: A system for displaying images is provided. The system includes a touch sensor device including a transparent substrate having a sensing region and a non-sensing region adjacent to the sensing region. A sensing electrode pattern layer is on the transparent substrate in the sensing region. An inorganic dielectric material layer is on the transparent substrate. The inorganic dielectric material layer has a first portion in the non-sensing region and a second portion in the sensing region and partially covering the sensing electrode pattern layer. A method of forming a touch sensor device is also disclosed.

公开(公告)号：US07509906B2

公开(公告)日：2009-03-31

申请号：US11319631

申请日：2005-12-29

Applicant: Bi Chu Wu ,  Gin Shu Young ,  Chung Kai Chen ,  Yu Ching Liu ,  Su Jan Lee

Inventor： Bi Chu Wu ,  Gin Shu Young ,  Chung Kai Chen ,  Yu Ching Liu ,  Su Jan Lee

IPC: F01B29/00 ,  F15B15/26

CPC classification number: F04B19/006 ,  B01L3/0293 ,  B01L3/50273 ,  B01L2400/0478 ,  B01L2400/0487 ,  B01L2400/082

Abstract: The present invention provides an off-chip apparatus and a method for driving micro fluid wherein one or a plurality of impedance members, plunger positioning members and pressure difference design are used to drive the fluid and control the flow speed in a microfluidic system. The present invention also provides a method for driving fluid and controlling flow speed, wherein a slow pressure balancing mechanism is produced by the foregoing device so the flow speed of fluid can be controlled.

Abstract translation: 本发明提供一种片外设备和一种驱动微流体的方法，其中使用一个或多个阻抗构件，柱塞定位构件和压差设计来驱动流体并控制微流体系统中的流速。 本发明还提供一种驱动流体并控制流速的方法，其中由上述装置产生缓慢的压力平衡机构，从而可以控制流体的流速。

公开(公告)号：US08737084B2

公开(公告)日：2014-05-27

申请号：US13285019

申请日：2011-10-31

Applicant: Yu-Ching Liu ,  Chi-An Yu ,  Zhi-Jun Wang ,  Hai-Yang Niu ,  Yong Tan ,  Ri-Qing Chen ,  Ling-Lin Yuan

Inventor： Yu-Ching Liu ,  Chi-An Yu ,  Zhi-Jun Wang ,  Hai-Yang Niu ,  Yong Tan ,  Ri-Qing Chen ,  Ling-Lin Yuan

IPC: H05K5/00

CPC classification number: H05K7/1417 ,  H05K1/02 ,  H05K2201/09145

Abstract: A printed circuit board (PCB) secured to a carrier, the carrier comprising at least one hook for securing the PCB, the PCB includes a first surface and a second surface opposite to the first surface. At least one recessed portion in the rim of the first surface receives at least one hook so there are no protrusions above the upper surface of the PCB. A carrier for securing the PCB is also provided.

Abstract translation: 一种固定到载体上的印刷电路板（PCB），所述载体包括用于固定所述PCB的至少一个钩子，所述PCB包括第一表面和与所述第一表面相对的第二表面。 第一表面的边缘中的至少一个凹部接收至少一个钩，因此在PCB的上表面上方没有突起。 还提供用于固定PCB的载体。

公开(公告)号：US20130014383A1

公开(公告)日：2013-01-17

申请号：US13482378

申请日：2012-05-29

Applicant: YU-CHING LIU ,  FU-CHI YANG ,  CHI-AN YU ,  YAN-HAO LI ,  XING XIA ,  WEN-ZHAO WU

Inventor： YU-CHING LIU ,  FU-CHI YANG ,  CHI-AN YU ,  YAN-HAO LI ,  XING XIA ,  WEN-ZHAO WU

IPC: B23P19/00

CPC classification number: B25J15/0253 ,  B25J9/042 ,  H05K13/0061 ,  Y10T29/53174

Abstract: A manipulator includes a main body, and a grasping device mounted to the main body. The grasping device includes a mounting board and two grasping members secured on the mounting board. The two grasping members move towards and away from each other, each grasping member is able to grasp a loader at a specific position of the loader.

Abstract translation: 机械手包括主体和安装在主体上的把持装置。 把持装置包括安装板和固定在安装板上的两个把持件。 两个夹持构件彼此移动并远离，每个抓持构件能够在装载器的特定位置处抓住装载器。

公开(公告)号：US20120236512A1

公开(公告)日：2012-09-20

申请号：US13285019

申请日：2011-10-31

Applicant: YU-CHING LIU ,  CHI-AN YU ,  ZHI-JUN WANG ,  HAI-YANG NIU ,  YONG TAN ,  RI-QING CHEN ,  LING-LIN YUAN

Inventor： YU-CHING LIU ,  CHI-AN YU ,  ZHI-JUN WANG ,  HAI-YANG NIU ,  YONG TAN ,  RI-QING CHEN ,  LING-LIN YUAN

IPC: H05K7/00 ,  H05K1/00

CPC classification number: H05K7/1417 ,  H05K1/02 ,  H05K2201/09145

Abstract: A printed circuit board (PCB) secured to a carrier, the carrier comprising at least one hook for securing the PCB, the PCB includes a first surface and a second surface opposite to the first surface. At least one recessed portion in the rim of the first surface receives at least one hook so there are no protrusions above the upper surface of the PCB. A carrier for securing the PCB is also provided.

Abstract translation: 一种固定到载体上的印刷电路板（PCB），所述载体包括用于固定所述PCB的至少一个钩子，所述PCB包括第一表面和与所述第一表面相对的第二表面。 第一表面的边缘中的至少一个凹部接收至少一个钩，因此在PCB的上表面上方没有突起。 还提供用于固定PCB的载体。

公开(公告)号：US07157269B2

公开(公告)日：2007-01-02

申请号：US10670225

申请日：2003-09-26

Applicant: Bor-Iaun Jan ,  Jia-Huey Tsao ,  Chih-Wei Ho ,  Yu-Ching Liu ,  Chao-Chi Pan ,  Zu-Sho Chow ,  Yao-Sung Chang ,  Cheng-Tao Wu ,  Wen-Hsun Kuo

Inventor： Bor-Iaun Jan ,  Jia-Huey Tsao ,  Chih-Wei Ho ,  Yu-Ching Liu ,  Chao-Chi Pan ,  Zu-Sho Chow ,  Yao-Sung Chang ,  Cheng-Tao Wu ,  Wen-Hsun Kuo

IPC: C12M3/00 ,  G01N33/566 ,  G01N33/00 ,  C07H21/04 ,  B01L3/00

CPC classification number: B82Y30/00 ,  B01J2219/00387 ,  B01J2219/00527 ,  B01J2219/00576 ,  B01J2219/00605 ,  B01J2219/0061 ,  B01J2219/00612 ,  B01J2219/00617 ,  B01J2219/00619 ,  B01J2219/00626 ,  B01J2219/00637 ,  B01J2219/00677 ,  B01J2219/0072 ,  B01J2219/00722 ,  B01J2219/00725 ,  B01J2219/00729 ,  C40B40/06 ,  C40B40/10 ,  C40B60/14 ,  G01N33/545 ,  G02B21/34 ,  Y10T436/143333

Abstract: The invention discloses an on-spot hydrophilic enhanced slide/microarray. The preparation method relates to a hydrophobic copolymer prepared by blending, grafting or co-polymerization of a hydrophobic material and a compound bearing functional groups such as anhydride, imide, cyclic amide, and cyclic ester, and application of the hydrophobic copolymer onto an organic or inorganic substrate. The resulting slide has the properties of on-spot hydrophilic/hydrophobic dynamic conversion, as well as on-spot hydrophilic enhancement for the preparation of high-density and high-efficiency bio-chip/microarray.

Abstract translation: 本发明公开了一种现场亲水增强载玻片/微阵列。 该制备方法涉及通过共混，接枝或共聚疏水材料和带有官能团的化合物如酸酐，酰亚胺，环状酰胺和环状酯制备的疏水性共聚物，以及将疏水性共聚物应用于有机或 无机底物。 所得到的载片具有现场亲水/疏水动态转化的性质，以及用于制备高密度和高效率生物芯片/微阵列的现场亲水增强。