Invention Grant
- Patent Title: Solder paste mixer
- Patent Title (中): 焊膏搅拌机
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Application No.: US13207454Application Date: 2011-08-11
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Publication No.: US08434929B2Publication Date: 2013-05-07
- Inventor: Yu-Ching Liu , Fu-Chi Yang , Chi-An Yu , Xi-Hang Li , Bing Liu , Jing-Bin Liang , Hai-Gui Huang , Xue-Bing Bao
- Applicant: Yu-Ching Liu , Fu-Chi Yang , Chi-An Yu , Xi-Hang Li , Bing Liu , Jing-Bin Liang , Hai-Gui Huang , Xue-Bing Bao
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201110047617 20110228
- Main IPC: B01F11/00
- IPC: B01F11/00 ; B01F11/02
Abstract:
A solder paste mixer includes a housing, a vibration mechanism, a rotating mechanism, and a fixture for fixing a solder paste jar. The housing defines a receiving space, and the vibration mechanism and the rotating mechanism are retained within the receiving space. The fixture can be vibrated by the vibration mechanism and rotated by the rotating mechanism.
Public/Granted literature
- US20120218853A1 SOLDER PASTE MIXER Public/Granted day:2012-08-30
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