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发明授权
US08436471B2 Semiconductor package with its surface edge covered by resin 有权
半导体封装，其表面边缘被树脂覆盖

Semiconductor package with its surface edge covered by resin
摘要：
A semiconductor package includes a semiconductor chip; a resin part configured to cover a side surface of the semiconductor chip; and a wiring structure formed on a circuit forming surface of the semiconductor chip and a surface of the resin part being situated at the same side as the circuit forming surface, the wiring structure being electrically connected to the semiconductor chip, wherein the resin part is formed so as to cover a part of a surface of the semiconductor chip situated at an opposite side to the circuit forming surface of the semiconductor chip.
摘要（中）：

半导体封装包括半导体芯片; 被配置为覆盖半导体芯片的侧表面的树脂部件; 以及形成在所述半导体芯片的电路形成表面上的布线结构，并且所述树脂部分的表面位于与所述电路形成表面相同的一侧，所述布线结构电连接到所述半导体芯片，其中形成所述树脂部分 以覆盖位于与半导体芯片的电路形成表面相对的一侧的半导体芯片的表面的一部分。

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