Invention Grant
US08437173B2 Nonvolatile memory element, manufacturing method thereof, design support method therefor, and nonvolatile memory device
有权
非易失性存储元件,其制造方法,设计支持方法和非易失性存储器件
- Patent Title: Nonvolatile memory element, manufacturing method thereof, design support method therefor, and nonvolatile memory device
- Patent Title (中): 非易失性存储元件,其制造方法,设计支持方法和非易失性存储器件
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Application No.: US13320654Application Date: 2011-03-16
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Publication No.: US08437173B2Publication Date: 2013-05-07
- Inventor: Yukio Hayakawa , Takumi Mikawa , Yoshio Kawashima , Takeki Ninomiya
- Applicant: Yukio Hayakawa , Takumi Mikawa , Yoshio Kawashima , Takeki Ninomiya
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, LLP.
- Priority: JP2010-064897 20100319
- International Application: PCT/JP2011/001543 WO 20110316
- International Announcement: WO2011/114725 WO 20110922
- Main IPC: G11C11/00
- IPC: G11C11/00

Abstract:
A nonvolatile memory element which can be initialized at low voltage includes a variable resistance layer (116) located between a lower electrode (105) and an upper electrode (107) and having a resistance value that reversibly changes based on electrical signals applied between these electrodes. The variable resistance layer (116) includes at least two layers: a first variable resistance layer (1161) including a first transition metal oxide (116b); and a second variable resistance layer (1162) including a second transition metal oxide (116a) and a third transition metal oxide (116c). The second transition metal oxide (116a) has an oxygen deficiency higher than either oxygen deficiency of the first transition metal oxide (116b) or the third transition metal oxide (116c), and the second transition metal oxide (116a) and the third transition metal oxide (116c) are in contact with the first variable resistance layer (1161).
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