Invention Grant
- Patent Title: Pre-plating solutions for making printed circuit boards and methods for preparing the same
- Patent Title (中): 制造印刷电路板的电镀前解决方案及其制备方法
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Application No.: US12195844Application Date: 2008-08-21
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Publication No.: US08440158B2Publication Date: 2013-05-14
- Inventor: Cheng-Hsien Lin , Yao-Wen Bai , Rui Zhang , Wen-Chin Lee
- Applicant: Cheng-Hsien Lin , Yao-Wen Bai , Rui Zhang , Wen-Chin Lee
- Applicant Address: CN Beijing TW New Taipei
- Assignee: Tsinghua University,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Tsinghua University,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Beijing TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200710077348 20070921
- Main IPC: D01F9/12
- IPC: D01F9/12 ; H01B1/04 ; H05K3/00
Abstract:
A pre-plating solution for making a printed circuit board includes carbon nanotubes of 0.01-3 wt %, a surfactant of 0.01-4 wt %, an alkaline substance of 0.01-1 wt % and a solvent. A method for preparing a pre-plating solution comprising the steps of: providing a plurality of carbon nanotubes; purifying the carbon nanotubes; treating the purified carbon nanotubes with an acid; mixing the treated carbon nanotubes, an alkaline substance and a solvent to form suspension; and adding surfactant into suspension.
Public/Granted literature
- US20090078578A1 PRE-PLATING SOLUTIONS FOR MAKING PRINTED CIRCUIT BOARDS AND METHODS FOR PREPARING THE SAME Public/Granted day:2009-03-26
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