Invention Grant
- Patent Title: Method of cutting substrate
- Patent Title (中): 基材切割方法
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Application No.: US12731479Application Date: 2010-03-25
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Publication No.: US08444906B2Publication Date: 2013-05-21
- Inventor: Hyun-Chul Lee , Jin-Han Park , Joon-Hyung Kim , Won-Kyu Lim , Jae-Seok Park , Cheol-Lae Roh , Yong-Jin Lee
- Applicant: Hyun-Chul Lee , Jin-Han Park , Joon-Hyung Kim , Won-Kyu Lim , Jae-Seok Park , Cheol-Lae Roh , Yong-Jin Lee
- Applicant Address: KR Yongin, Gyeonggi-Do
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin, Gyeonggi-Do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2009-0025453 20090325
- Main IPC: C03B33/02
- IPC: C03B33/02 ; B23K26/36
Abstract:
A substrate cutting method includes the steps of aligning a panel including two or more substrates, along a cutting line, forming groove lines in the respective substrates of the panel along the cutting line, by oscillating respective ultraviolet UV laser beams along the cutting line, and cutting the panel along the groove lines, by applying force to the panel.
Public/Granted literature
- US20100243623A1 METHOD OF CUTTING SUBSTRATE Public/Granted day:2010-09-30
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