A glass substrate is held by a glass substrate holding member in the vertical direction, and a nozzle is used to eject an infrared cutoff liquid onto the upper portion of the glass substrate. The infrared cutoff liquid flows vertically downward so as to be applied onto the glass substrate. The film thickness of the lower portion of an infrared cutoff film is greater than that of the upper portion. The glass substrate is dried for approximately five minutes at room temperature. Then, the glass substrate onto which the infrared cutoff liquid has been applied is placed in an oven preheated to 200° C., heated for ten minutes, and then cooled. The glass substrate having the infrared cutoff film thereon is installed in a railroad vehicle such that the lower portion of the glass substrate is located on the lower side with respect to the railroad vehicle.