发明授权
US08446707B1 Circuitized substrate with low loss capacitive material and method of making same
有权
具有低损耗电容性材料的电路化基板及其制造方法
- 专利标题: Circuitized substrate with low loss capacitive material and method of making same
- 专利标题(中): 具有低损耗电容性材料的电路化基板及其制造方法
-
申请号: US13269770申请日: 2011-10-10
-
公开(公告)号: US08446707B1公开(公告)日: 2013-05-21
- 发明人: Rabindra N. Das , Konstantinos I. Papathomas , Voya R. Markovich , James J. McNamara
- 申请人: Rabindra N. Das , Konstantinos I. Papathomas , Voya R. Markovich , James J. McNamara
- 申请人地址: US NY Endicott
- 专利权人: Endicott Interconnect Technologies, Inc.
- 当前专利权人: Endicott Interconnect Technologies, Inc.
- 当前专利权人地址: US NY Endicott
- 代理机构: Hinman, Howard & Kattell, LLP
- 代理商 Mark Levy
- 主分类号: H01G4/06
- IPC分类号: H01G4/06
摘要:
A low loss capacitance and low loss insulating dielectric material consisting of a thermosetting resin, thermoplastic resin, a cross-linker, and containing a quantity of ferroelectric ceramic nano-particles of barium titanate within. The combined low loss insulating dielectric layer and a low loss capacitive layer resulting from the material allows one continuous layer that can form internal capacitors and permit the modifying the dielectric thickness between signal layers for impedance matching within a layer of substrate. More significantly, the applied layer of low loss capacitive materials can simultaneously act as a capacitor as well as a dielectric for separation of signal layers.