发明授权
US08446707B1 Circuitized substrate with low loss capacitive material and method of making same 有权
具有低损耗电容性材料的电路化基板及其制造方法

Circuitized substrate with low loss capacitive material and method of making same
摘要:
A low loss capacitance and low loss insulating dielectric material consisting of a thermosetting resin, thermoplastic resin, a cross-linker, and containing a quantity of ferroelectric ceramic nano-particles of barium titanate within. The combined low loss insulating dielectric layer and a low loss capacitive layer resulting from the material allows one continuous layer that can form internal capacitors and permit the modifying the dielectric thickness between signal layers for impedance matching within a layer of substrate. More significantly, the applied layer of low loss capacitive materials can simultaneously act as a capacitor as well as a dielectric for separation of signal layers.
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