发明授权
- 专利标题: Method of manufacturing liquid ejection head substrate
- 专利标题(中): 液体喷射头基板的制造方法
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申请号: US13545370申请日: 2012-07-10
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公开(公告)号: US08449783B2公开(公告)日: 2013-05-28
- 发明人: Keiji Watanabe
- 申请人: Keiji Watanabe
- 申请人地址: JP Tokyo
- 专利权人: Canon Kabushiki Kaisha
- 当前专利权人: Canon Kabushiki Kaisha
- 当前专利权人地址: JP Tokyo
- 代理机构: Fitzpatrick, Cella, Harper & Scinto
- 优先权: JP2011-166494 20110729
- 主分类号: H01B13/00
- IPC分类号: H01B13/00
摘要:
A liquid ejection head substrate is manufactured by forming a wiring pattern on one surface of a substrate, forming an etching mask layer on the other surface of the substrate, forming a positioning reference mark on the etching mask layer by means of a laser, forming an opening pattern groove running through the etching mask layer and having a bottom in the inside of the silicon substrate, using the positioning reference mark, and forming a liquid supply port running through the silicon substrate by etching the silicon substrate from the opening pattern groove to the one surface by means of crystal anisotropic etching.
公开/授权文献
- US20130026130A1 METHOD OF MANUFACTURING LIQUID EJECTION HEAD SUBSTRATE 公开/授权日:2013-01-31