Invention Grant
US08450134B2 Trench process and structure for backside contact solar cells with polysilicon doped regions
有权
具有多晶硅掺杂区域的背面接触太阳能电池的沟槽工艺和结构
- Patent Title: Trench process and structure for backside contact solar cells with polysilicon doped regions
- Patent Title (中): 具有多晶硅掺杂区域的背面接触太阳能电池的沟槽工艺和结构
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Application No.: US12945555Application Date: 2010-11-12
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Publication No.: US08450134B2Publication Date: 2013-05-28
- Inventor: Denis De Ceuster , Peter John Cousins , David D. Smith
- Applicant: Denis De Ceuster , Peter John Cousins , David D. Smith
- Applicant Address: US CA San Jose
- Assignee: SunPower Corporation
- Current Assignee: SunPower Corporation
- Current Assignee Address: US CA San Jose
- Agency: Okamoto & Benedicto LLP
- Main IPC: H01L31/18
- IPC: H01L31/18

Abstract:
A solar cell includes polysilicon P-type and N-type doped regions on a backside of a substrate, such as a silicon wafer. An interrupted trench structure separates the P-type doped region from the N-type doped region in some locations but allows the P-type doped region and the N-type doped region to touch in other locations. Each of the P-type and N-type doped regions may be formed over a thin dielectric layer. Among other advantages, the resulting solar cell structure allows for increased efficiency while having a relatively low reverse breakdown voltage.
Public/Granted literature
- US20110059571A1 Trench Process and Structure for Backside Contact Solar Cells with Polysilicon Doped Regions Public/Granted day:2011-03-10
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