A socket for receiving an IC (integrate circuit) package comprises an insulative housing and a plurality of contacts. The insulative housing defines a plurality of contact passageways for receiving the contacts. Each contact has a retaining portion, an elastic arm and a soldering portion, and the retaining portion is formed with a first part, a second part and a bending part between the first and the second parts. Each of the first and the second parts is formed with a protrusion on an outside lateral edge thereof away from the bending part for interfering with the contact passageway of the insulative housing to retain the contact to the insulative housing.