发明授权
- 专利标题: Polishing method and apparatus
- 专利标题(中): 抛光方法和设备
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申请号: US12511344申请日: 2009-07-29
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公开(公告)号: US08454407B2公开(公告)日: 2013-06-04
- 发明人: Taro Takahashi , Motohiro Niijima , Akihiko Ogawa
- 申请人: Taro Takahashi , Motohiro Niijima , Akihiko Ogawa
- 申请人地址: JP Tokyo
- 专利权人: Ebara Corporation
- 当前专利权人: Ebara Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 优先权: JP2008-201915 20080805; JP2009-167788 20090716
- 主分类号: B24B49/12
- IPC分类号: B24B49/12
摘要:
A polishing method polishes and planarizes a substrate. The substrate is pressed against a polishing surface on a rotating polishing table. During polishing, the polishing table is rotated, and the surface, being polished, of the substrate is scanned by an eddy current sensor provided in the polishing table. An output of the eddy current sensor is monitored, and substrate damage is detected from a change in the output of the eddy current sensor. Further, an output of an end point detecting sensor obtained by scanning the surface of the substrate is monitored, and the polishing end point is detected from a change in the output of the end point detecting sensor. After detecting the polishing end point, an output of the end point detecting sensor or another sensor is monitored, and detecting a film left on a part of the substrate is performed.
公开/授权文献
- US20100035516A1 POLISHING METHOD AND APPARATUS 公开/授权日:2010-02-11