Invention Grant
- Patent Title: Endovascular conduit device with low profile occlusion members
- Patent Title (中): 具有低剖面闭塞成员的血管内导管装置
-
Application No.: US12896092Application Date: 2010-10-01
-
Publication No.: US08454680B2Publication Date: 2013-06-04
- Inventor: Sumit Verma
- Applicant: Sumit Verma
- Applicant Address: US FL Pensacola
- Assignee: Atrial Systems, LLC
- Current Assignee: Atrial Systems, LLC
- Current Assignee Address: US FL Pensacola
- Agency: Brown Rudnick LLP
- Agent Mark S. Leonardo
- Main IPC: A61F2/06
- IPC: A61F2/06 ; A61F11/00

Abstract:
An endovascular conduit device and method for use during cardiac lead extraction and other vascular procedures is presented. The endovascular conduit device includes an outer-sheath, a conduit member, a lumen member, and an inflation member to control the flow of fluid within the conduit member. The endovascular conduit device may be positioned intravascularly as cardiac lead extraction or other procedures are performed. If necessary, as in the case of a vascular tear, the endovascular conduit device further includes expandable members that are activated to allow blood to be forced into the channel of the conduit member. Blood may then be contained and directed safely to bypass the area of vessel injury. In doing so, a catastrophic circulatory collapse or shock is prevented.
Public/Granted literature
- US20110082465A1 ENDOVASCULAR CONDUIT DEVICE WITH LOW PROFILE OCCLUSION MEMBERS Public/Granted day:2011-04-07
Information query
IPC分类: