Invention Grant
- Patent Title: Wafer cleaning with immersed stream or spray nozzle
- Patent Title (中): 用浸没流或喷嘴进行晶片清洗
-
Application No.: US12476139Application Date: 2009-06-01
-
Publication No.: US08454760B2Publication Date: 2013-06-04
- Inventor: Donald L. Yates
- Applicant: Donald L. Yates
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: B08B3/02
- IPC: B08B3/02

Abstract:
Several methods of removing contaminant particles from a surface of a substrate are disclosed herein. In one embodiment, the method includes directing an incompressible fluid spray onto a surface of a substrate to remove contaminant particles from the surface. In an embodiment, the surface of the substrate and the nozzle are both immersed in an incompressible fluid. The fluid can flow across the surface of the substrate to remove the contaminant particles from the area. The fluid spray can be positioned normal to the substrate surface, or can be positioned at an angle relative to the substrate surface.
Public/Granted literature
- US20100300491A1 WAFER CLEANING WITH IMMERSED STREAM OR SPRAY NOZZLE Public/Granted day:2010-12-02
Information query
IPC分类: