- 专利标题: Light emitting device and method of manufacturing the same
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申请号: US13188513申请日: 2011-07-22
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公开(公告)号: US08455916B2公开(公告)日: 2013-06-04
- 发明人: Takeshi Nishi , Yasuo Nakamura
- 申请人: Takeshi Nishi , Yasuo Nakamura
- 申请人地址: JP Kanagawa-ken
- 专利权人: Semiconductor Energy Laboratory, Ltd.
- 当前专利权人: Semiconductor Energy Laboratory, Ltd.
- 当前专利权人地址: JP Kanagawa-ken
- 代理机构: Fish & Richardson P.C.
- 优先权: JP2002-197424 20020705
- 主分类号: H01L51/50
- IPC分类号: H01L51/50 ; H01L33/54 ; H01L33/56 ; H01L51/52 ; H01L27/32
摘要:
A light emitting device having a structure in which oxygen and moisture are prevented from reaching light emitting elements, and a method of manufacturing the same, are provided. Further, the light emitting elements are sealed by using a small number of process steps, without enclosing a drying agent. The present invention has a top surface emission structure. A substrate on which the light emitting elements are formed is bonded to a transparent sealing substrate. The structure is one in which a transparent second sealing material covers the entire surface of a pixel region when bonding the two substrates, and a first sealing material (having a higher viscosity than the second sealing material), which contains a gap material (filler, fine particles, or the like) for protecting a gap between the two substrates, surrounds the pixel region. The two substrates are seated by the first sealing material and the second sealing material. Further, reaction between electrodes of the light emitting elements (cathodes or anodes) and the sealing materials can be prevented by covering the electrodes with a transparent protective layer, for example, CaF2, MgF2, or BaF2.
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