Invention Grant
US08455990B2 Systems and methods of tamper proof packaging of a semiconductor device
有权
一种半导体器件防篡改封装的系统和方法
- Patent Title: Systems and methods of tamper proof packaging of a semiconductor device
- Patent Title (中): 一种半导体器件防篡改封装的系统和方法
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Application No.: US12713141Application Date: 2010-02-25
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Publication No.: US08455990B2Publication Date: 2013-06-04
- Inventor: Robert W Warren , Hyun Jung Lee , Nic Rossi
- Applicant: Robert W Warren , Hyun Jung Lee , Nic Rossi
- Applicant Address: US CA Newport Beach
- Assignee: Conexant Systems, Inc.
- Current Assignee: Conexant Systems, Inc.
- Current Assignee Address: US CA Newport Beach
- Agency: Jackson Walker L.L.P.
- Agent Christopher J. Rourk
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L21/50
Abstract:
A barrier layer can be attached in a semiconductor package to one or more sensitive devices. The barrier layer can be used to obstruct tampering by a malicious agent attempting to access sensitive information on the sensitive device. The barrier layer can cause the sensitive device to become inoperable if physically tampered. Additional other aspects of the protective packaging provide protection against x-ray and thermal probing as well as chemical and electrical tampering attempts.
Public/Granted literature
- US20100213590A1 Systems and Methods of Tamper Proof Packaging of a Semiconductor Device Public/Granted day:2010-08-26
Information query
IPC分类:
