Invention Grant
- Patent Title: Semiconductor module and an electronic system including the same
- Patent Title (中): 半导体模块和包括其的电子系统
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Application No.: US12554173Application Date: 2009-09-04
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Publication No.: US08456000B2Publication Date: 2013-06-04
- Inventor: Joong-Hyun Baek
- Applicant: Joong-Hyun Baek
- Applicant Address: KR Suwon-si
- Assignee: Stanzione & Kim, LLP
- Current Assignee: Stanzione & Kim, LLP
- Current Assignee Address: KR Suwon-si
- Agency: Stanzione & Kim, LLP
- Priority: KR10-2008-0088880 20080909
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/053 ; H01L23/12 ; H01L23/34 ; H01L23/04 ; H02B1/00 ; H05K7/00 ; H05K1/00 ; H05K1/18 ; H05K1/11 ; H05K1/14

Abstract:
A three-dimensional semiconductor module and an electronic system including the same are provided. The semiconductor module includes a module substrate, a logic device formed on a part of the module substrate, and a plurality of memory devices formed on another part of the module substrate, wherein the plurality of memory devices are disposed perpendicular to the logic device, and the module substrate on which the plurality of memory devices are formed is supported by a supporter. The electronic system includes the semiconductor module.
Public/Granted literature
- US20100059880A1 SEMICONDUCTOR MODULE AND AN ELECTRONIC SYSTEM INCLUDING THE SAME Public/Granted day:2010-03-11
Information query
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