发明授权
- 专利标题: Modular data center cooling
- 专利标题(中): 模块化数据中心冷却
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申请号: US13093098申请日: 2011-04-25
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公开(公告)号: US08456840B1公开(公告)日: 2013-06-04
- 发明人: Jimmy Clidaras , William Hamburgen , Winnie Leung , David W. Stiver , Andrew B. Carlson , Steven T. Y. Chow , Jonathan D. Beck
- 申请人: Jimmy Clidaras , William Hamburgen , Winnie Leung , David W. Stiver , Andrew B. Carlson , Steven T. Y. Chow , Jonathan D. Beck
- 申请人地址: US CA Mountain View
- 专利权人: Exaflop LLC
- 当前专利权人: Exaflop LLC
- 当前专利权人地址: US CA Mountain View
- 代理机构: Fish & Richardson P.C.
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
A rack-mount computer system includes one or more rows of computer racks, wherein each row of computer racks includes a pair of rows of computer racks positioned back-to-back relative to each other, a plurality of computer motherboards mounted in each of the racks in each row of computer racks and having front edges open to a workspace for receiving circulating air over the motherboards, the motherboards positioned to create a warm air plenum near a back edge of each motherboard, and a fan positioned adjacent each of the plurality of computer motherboards to circulate air across the computer motherboards and into the warm air plenum.
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