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18 条记录 (耗时 0.021 秒)

    Targeted cooling for datacenters
    1.
    发明授权
    Targeted cooling for datacenters 有权
    针对数据中心的冷却

    公开(公告)号：US09060451B2

    公开(公告)日：2015-06-16

    申请号：US11679024

    申请日：2007-02-26

    申请人： Jimmy Clidaras ,  Winnie Leung

    发明人： Jimmy Clidaras ,  Winnie Leung

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20754 ,  H05K7/20745 ,  H05K7/20836

    摘要： A method of cooling electronic equipment is disclosed and includes substantially continuously circulating ambient air across a plurality of rack-mounted electronic devices, monitoring the temperature of air in or around a group of devices in the plurality of rack-mounted electronic devices, and providing substantially cooler-than-ambient air to the group of devices when the monitored air temperatures rises above a set value.

    摘要翻译： 公开了一种冷却电子设备的方法，并且包括在多个机架安装的电子设备中基本上连续地循环环境空气，监测多个机架安装的电子设备中的一组设备内或周围的空气的温度， 当监测到的空气温度升高到设定值以上时，比该组设备冷却至大气的空气。

    Targeted Cooling for Datacenters
    2.
    发明申请
    Targeted Cooling for Datacenters 有权
    数据中心目标冷却

    公开(公告)号：US20080204999A1

    公开(公告)日：2008-08-28

    申请号：US11679024

    申请日：2007-02-26

    申请人： Jimmy Clidaras ,  Winnie Leung

    发明人： Jimmy Clidaras ,  Winnie Leung

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20754 ,  H05K7/20745 ,  H05K7/20836

    摘要： A method of cooling electronic equipment is disclosed and includes substantially continuously circulating ambient air across a plurality of rack-mounted electronic devices, monitoring the temperature of air in or around a group of devices in the plurality of rack-mounted electronic devices, and providing substantially cooler-than-ambient air to the group of devices when the monitored air temperatures rises above a set value.

    摘要翻译： 公开了一种冷却电子设备的方法，并且包括在多个机架安装的电子设备中基本上连续地循环环境空气，监测多个机架安装的电子设备中的一组设备内或周围的空气的温度， 当监测到的空气温度升高到设定值以上时，比该组设备冷却至大气的空气。

    Motherboards with Integrated Cooling
    3.
    发明申请
    Motherboards with Integrated Cooling 有权
    集成冷却主板

    公开(公告)号：US20080158818A1

    公开(公告)日：2008-07-03

    申请号：US11618611

    申请日：2006-12-29

    申请人： Jimmy Clidaras ,  Winnie Leung

    发明人： Jimmy Clidaras ,  Winnie Leung

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20727 ,  G06F1/206 ,  G06F2200/201 ,  H05K7/20772

    摘要： A computer apparatus includes a first motherboard having a top surface and a bottom surface, a second motherboard having a top surface and a bottom surface, and a heat sink in conductive thermal contact with the top surfaces of the first and second motherboards. Computer components generating high thermal loads are mounted to the top surfaces of the motherboards, and computer components generating low thermal loads are mounted to the bottom surface of one or more of the motherboards.

    摘要翻译： 计算机装置包括具有顶表面和底表面的第一母板，具有顶表面和底表面的第二母板以及与第一和第二母板的顶表面导电热接触的散热器。 产生高热负荷的计算机部件被安装到主板的顶表面，并且产生低热负载的计算机部件被安装到一个或多个主板的底表面。

    Modular Computing Environments
    4.
    发明申请
    Modular Computing Environments 有权
    模块化计算环境

    公开(公告)号：US20080055846A1

    公开(公告)日：2008-03-06

    申请号：US11757101

    申请日：2007-06-01

    申请人： Jimmy Clidaras ,  William Whitted ,  William Hamburgen ,  Montgomery Sykora ,  Winnie Leung ,  Gerald Aigner ,  Donald Beaty

    发明人： Jimmy Clidaras ,  William Whitted ,  William Hamburgen ,  Montgomery Sykora ,  Winnie Leung ,  Gerald Aigner ,  Donald Beaty

    IPC分类号： H05K7/20 ,  A47B81/00 ,  G06F1/16

    CPC分类号： H05K7/202 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/1497 ,  H05K7/20754 ,  H05K7/2079

    摘要： A computer system may include a connecting hub having a plurality of docking regions and be configured to provide to each docking region electrical power, a data network interface, a cooling fluid supply and a cooling fluid return; and a plurality of shipping containers that each enclose a modular computing environment that incrementally adds computing power to the system. Each shipping container may include a) a plurality of processing units coupled to the data network interface, each of which include a microprocessor; b) a heat exchanger configured to remove heat generated by the plurality of processing units by circulating cooling fluid from the supply through the heat exchanger and discharging it into the return; and c) docking members configured to releaseably couple to the connecting hub at one of the docking regions to receive electrical power, connect to the data network interface, and receive and discharge cooling fluid.

    摘要翻译： 计算机系统可以包括具有多个对接区域并且被配置为向每个对接区域提供电力，数据网络接口，冷却流体供应和冷却流体返回的连接毂; 以及多个运输容器，每个运输容器都包围向计算机系统增加计算能力的模块化计算环境。 每个运输容器可以包括：a）耦合到数据网络接口的多个处理单元，每个处理单元包括微处理器; b）热交换器，其被配置为通过使来自所述供应器的冷却流体通过所述热交换器循环并将其排出到所述回流中来除去由所述多个处理单元产生的热量; 以及c）对接构件，其构造成在一个对接区域处可释放地联接到所述连接毂，以接收电力，连接到所述数据网络接口，以及接收和排出冷却流体。

    Interchangeable rack system
    5.
    发明授权
    Interchangeable rack system 有权
    可更换机架系统

    公开(公告)号：US09395508B1

    公开(公告)日：2016-07-19

    申请号：US13345147

    申请日：2012-01-06

    申请人： William Dailey ,  Winnie Leung ,  Angela Ying-Ju Chen ,  Michael John Bliss

    发明人： William Dailey ,  Winnie Leung ,  Angela Ying-Ju Chen ,  Michael John Bliss

    IPC分类号： G02B6/44

    CPC分类号： H05K7/1489 ,  G02B6/4452 ,  G02B6/4471 ,  H04Q1/09 ,  H05K7/1417 ,  H05K7/1488 ,  H05K7/1492

    摘要： Aspects of the disclosure relate generally to rack systems for housing computing devices. The rack may include shelves supported by flanges of a pair of corresponding inserts. The flanges may be spaced along the length of each of the inserts. The distance between the flanges may define the height of a shelf when placed in the rack. The pair of corresponding inserts may be placed along an inner sidewall of the rack by mating hooks of the inserts with corresponding slots of the inner sidewall and subsequently removed by demating the hooks and slots. For example, a pair of inserts with one distance between the flanges may be replaced by a pair of inserts with another distance between the flanges in order to increase the shelf height of the rack. By replacing the shelves and/or the inserts, a user may quickly and easily in order to reconfigure the rack.

    摘要翻译： 本公开的方面通常涉及用于外壳计算设备的机架系统。 机架可以包括由一对相应插入件的凸缘支撑的搁板。 凸缘可以沿着每个插入件的长度间隔开。 凸缘之间的距离可以限定架子放置在机架中时的高度。 一对相应的插入件可以通过插入件的钩与内侧壁的相应槽配合而沿着齿条的内侧面放置，随后通过使钩和槽排出来去除。 例如，在凸缘之间具有一个距离的一对插入件可以被一对插入件替代，以在凸缘之间具有另一距离，以便增加机架的搁架高度。 通过更换架子和/或插入件，用户可以快速而容易地重新配置机架。

    Modular computing environments
    6.
    发明授权
    Modular computing environments 有权
    模块化计算环境

    公开(公告)号：US08743543B2

    公开(公告)日：2014-06-03

    申请号：US13544839

    申请日：2012-07-09

    申请人： Jimmy Clidaras ,  William Whitted ,  William Hamburgen ,  Montgomery Sykora ,  Winnie Leung ,  Gerald Aigner ,  Donald L. Beaty

    发明人： Jimmy Clidaras ,  William Whitted ,  William Hamburgen ,  Montgomery Sykora ,  Winnie Leung ,  Gerald Aigner ,  Donald L. Beaty

    IPC分类号： H05K7/20 ,  F25D23/12 ,  F28F7/00 ,  B60F1/00 ,  G06F15/16 ,  G06F13/00

    CPC分类号： H05K7/202 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/1497 ,  H05K7/20754 ,  H05K7/2079

    摘要： A computer system may include a connecting hub having a plurality of docking regions and be configured to provide to each docking region electrical power, a data network interface, a cooling fluid supply and a cooling fluid return; and a plurality of shipping containers that each enclose a modular computing environment that incrementally adds computing power to the system. Each shipping container may include a) a plurality of processing units coupled to the data network interface, each of which include a microprocessor; b) a heat exchanger configured to remove heat generated by the plurality of processing units by circulating cooling fluid from the supply through the heat exchanger and discharging it into the return; and c) docking members configured to releaseably couple to the connecting hub at one of the docking regions to receive electrical power, connect to the data network interface, and receive and discharge cooling fluid.

    摘要翻译： 计算机系统可以包括具有多个对接区域并且被配置为向每个对接区域提供电力，数据网络接口，冷却流体供应和冷却流体返回的连接毂; 以及多个运输容器，每个运输容器都包围向计算机系统增加计算能力的模块化计算环境。 每个运输容器可以包括：a）耦合到数据网络接口的多个处理单元，每个处理单元包括微处理器; b）热交换器，其被配置为通过使来自所述供应器的冷却流体通过所述热交换器循环并将其排出到所述回流中来除去由所述多个处理单元产生的热量; 以及c）对接构件，其构造成在一个对接区域处可释放地联接到所述连接毂，以接收电力，连接到所述数据网络接口，以及接收和排出冷却流体。

    Computing Environments
    9.
    发明申请
    Computing Environments 有权
    计算环境

    公开(公告)号：US20070281639A1

    公开(公告)日：2007-12-06

    申请号：US11757347

    申请日：2007-06-01

    申请人： Jimmy Clidaras ,  William Hamburgen ,  Andrew Carlson ,  Steven Y. Chow ,  Winnie Leung ,  Montgomery Sykora ,  Donald L. Beaty

    发明人： Jimmy Clidaras ,  William Hamburgen ,  Andrew Carlson ,  Steven Y. Chow ,  Winnie Leung ,  Montgomery Sykora ,  Donald L. Beaty

    IPC分类号： H04B1/034

    CPC分类号： H05K7/20136 ,  A62C3/16 ,  G06F1/20 ,  H05K7/1497 ,  H05K7/20727 ,  H05K7/20736

    摘要： A system can include an enclosure having an exterior surface and an interior region that is characterized by a width and a length that is longer than the width; a plurality of trays mounted in racks that line a majority of each side of the length of the interior region and that define an aisle therebetween which is suitable for passage by one or more human occupants; cooling coils configured to capture heat generated by the plurality of trays and exhaust the heat outside the interior region; a plurality of connections on the exterior surface for supplying electrical power to the plurality of trays, supplying cooling fluid to the cooling coils, and for receiving cooling fluid discharged from the cooling coils; and doors at either end of the aisle configured and positioned to facilitate emergency egress from the enclosure by a human occupant.

    摘要翻译： 系统可以包括具有外表面和内部区域的外壳，其特征在于宽度和长度大于宽度; 安装在机架上的多个托盘，其沿着内部区域的长度的每一侧的大部分排列，并且在其间限定适于通过一个或多个人的居住者的通道; 冷却盘管构造成捕获由多个托盘产生的热并将热量排出到内部区域外部; 在所述外表面上具有用于向所述多个托盘供电的多个连接，将冷却流体供应到所述冷却盘管，以及用于接收从所述冷却盘管排出的冷却流体; 并且通道的任一端的门被配置和定位成便于人类乘客从外壳的紧急出口。