Invention Grant
US08457920B2 Performance improvement for a multi-chip system via kerf area interconnect
失效
通过切口区域互连实现多芯片系统的性能改进
- Patent Title: Performance improvement for a multi-chip system via kerf area interconnect
- Patent Title (中): 通过切口区域互连实现多芯片系统的性能改进
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Application No.: US12789669Application Date: 2010-05-28
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Publication No.: US08457920B2Publication Date: 2013-06-04
- Inventor: Benjamin A. Fox , Nathaniel J. Gibbs , Andrew B. Maki , Trevor J. Timpane
- Applicant: Benjamin A. Fox , Nathaniel J. Gibbs , Andrew B. Maki , Trevor J. Timpane
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Jim Boice
- Main IPC: G01R31/28
- IPC: G01R31/28
Abstract:
A semiconductor wafer comprises a first chip and a second chip, each chip comprising a core, link layer and physical layer. A kerf area physically connects the two chips on the wafer, and a kerf area interconnect selectively couples the link layers of the two chips while the two physical layers are disabled.
Public/Granted literature
- US20110295543A1 PERFORMANCE IMPROVEMENT FOR A MULTI-CHIP SYSTEM VIA KERF AREA INTERCONNECT Public/Granted day:2011-12-01
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