Invention Grant
- Patent Title: Method for manufacturing a circuit for high temperature and high g-force environments
- Patent Title (中): 制造高温高压环境电路的方法
-
Application No.: US13236083Application Date: 2011-09-19
-
Publication No.: US08458899B2Publication Date: 2013-06-11
- Inventor: David J. Mitchell , Anand A. Kulkarni , Ramesh Subramanian , Edward R. Roesch , Rod Waits , Roberto Schupbach , John R. Fraley , Alexander B. Lostetter , Brice McPherson , Bryon Western
- Applicant: David J. Mitchell , Anand A. Kulkarni , Ramesh Subramanian , Edward R. Roesch , Rod Waits , Roberto Schupbach , John R. Fraley , Alexander B. Lostetter , Brice McPherson , Bryon Western
- Applicant Address: US FL Orlando
- Assignee: Siemens Energy, Inc.
- Current Assignee: Siemens Energy, Inc.
- Current Assignee Address: US FL Orlando
- Main IPC: H05K3/20
- IPC: H05K3/20
Abstract:
A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.
Public/Granted literature
- US20120005891A1 WIRELESS TELEMETRY ELECTRONIC CIRCUIT BOARD FOR HIGH TEMPERATURE ENVIRONMENTS Public/Granted day:2012-01-12
Information query
