Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13127005Application Date: 2010-07-07
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Publication No.: US08461570B2Publication Date: 2013-06-11
- Inventor: Kei Fujii , Takashi Ishizuka , Katsushi Akita , Youichi Nagai , Tatsuya Tanabe
- Applicant: Kei Fujii , Takashi Ishizuka , Katsushi Akita , Youichi Nagai , Tatsuya Tanabe
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Tamatane J. Aga
- Priority: JP2009-180242 20090801; JP2009-206317 20090907
- International Application: PCT/JP2010/061511 WO 20100707
- International Announcement: WO2011/016309 WO 20110210
- Main IPC: H01L31/0352
- IPC: H01L31/0352 ; H01L31/0256 ; G02F1/017

Abstract:
A method for manufacturing a semiconductor device, by which a multiple quantum well structure having a large number of pairs can be efficiently grown while maintaining good crystalline quality, and the semiconductor device, are provided. The semiconductor device manufacturing method of the present invention includes a step of forming a multiple quantum well structure 3 having 50 or more pairs of group III-V compound semiconductor quantum wells. In the step of forming the multiple quantum well structure 3, the multiple quantum well structure is formed by metal-organic vapor phase epitaxy using only metal-organic sources (all metal-organic source MOVPE).
Public/Granted literature
- US20110210313A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2011-09-01
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