Invention Grant
- Patent Title: Semiconductor device and method of fabricating same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13178755Application Date: 2011-07-08
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Publication No.: US08461629B2Publication Date: 2013-06-11
- Inventor: Chung Long Cheng , Sheng-Chen Chung , Kong-Beng Thei , Harry Chuang , Mong-Song Liang
- Applicant: Chung Long Cheng , Sheng-Chen Chung , Kong-Beng Thei , Harry Chuang , Mong-Song Liang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor device having a core device with a high-k gate dielectric and an I/O device with a silicon dioxide or other non-high-k gate dielectric, and a method of fabricating such a device. A core well and an I/O well are created in a semiconductor substrate and separated by an isolation structure. An I/O device is formed over the I/O well and has a silicon dioxide or a low-k gate dielectric. A resistor may be formed on an isolation structure adjacent to the core well. A core-well device such as a transistor is formed over the core well, and has a high-k gate dielectric. In some embodiments, a p-type I/O well and an n-type I/O well are created. In a preferred embodiment, the I/O device or devices are formed prior to forming the core device and protected with a sacrificial layer until the core device is fabricated.
Public/Granted literature
- US20110260251A1 Semiconductor Device and Method of Fabricating Same Public/Granted day:2011-10-27
Information query
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