发明授权
US08461656B2 Device structures for in-plane and out-of-plane sensing micro-electro-mechanical systems (MEMS)
有权
用于平面内和平面外感测微机电系统(MEMS)的器件结构
- 专利标题: Device structures for in-plane and out-of-plane sensing micro-electro-mechanical systems (MEMS)
- 专利标题(中): 用于平面内和平面外感测微机电系统(MEMS)的器件结构
-
申请号: US12827848申请日: 2010-06-30
-
公开(公告)号: US08461656B2公开(公告)日: 2013-06-11
- 发明人: Woo Tae Park , Lisa H. Karlin , Lianjun Liu , Heinz Loreck , Hemant D. Desai
- 申请人: Woo Tae Park , Lisa H. Karlin , Lianjun Liu , Heinz Loreck , Hemant D. Desai
- 申请人地址: US TX Austin
- 专利权人: Freescale Semiconductor, Inc.
- 当前专利权人: Freescale Semiconductor, Inc.
- 当前专利权人地址: US TX Austin
- 代理商 James L. Clingan, Jr.
- 主分类号: H04R23/00
- IPC分类号: H04R23/00
摘要:
A device structure is made using a first conductive layer over a first wafer. An isolated conductive region is formed in the first conductive layer surrounded by a first opening in the conductive layer. A second wafer has a first insulating layer and a conductive substrate, wherein the conductive substrate has a first major surface adjacent to the first insulating layer. The insulating layer is attached to the isolated conductive region. The conductive substrate is thinned to form a second conductive layer. A second opening is formed through the second conductive layer and the first insulating layer to the isolated conductive region. The second opening is filled with a conductive plug wherein the conductive plug contacts the isolated conductive region. The second conductive region is etched to form a movable finger over the isolated conductive region. A portion of the insulating layer under the movable finger is removed.