Invention Grant
US08461662B2 Carbon/epoxy resin composition, and carbon-epoxy dielectric film produced by using the same
有权
碳/环氧树脂组合物和使用它们的碳 - 环氧电介质膜
- Patent Title: Carbon/epoxy resin composition, and carbon-epoxy dielectric film produced by using the same
- Patent Title (中): 碳/环氧树脂组合物和使用它们的碳 - 环氧电介质膜
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Application No.: US12710742Application Date: 2010-02-23
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Publication No.: US08461662B2Publication Date: 2013-06-11
- Inventor: Eun-Sung Lee , Jin-Young Bae , Yoo-Seong Yang , Sang-Soo Jee
- Applicant: Eun-Sung Lee , Jin-Young Bae , Yoo-Seong Yang , Sang-Soo Jee
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2009-0057237 20090625
- Main IPC: H01L21/02
- IPC: H01L21/02
Abstract:
A carbon/epoxy composition includes a bisphenol-based epoxy, an amine-based curing agent, an imidazole-based curing catalyst, and carbon black. A carbon-epoxy dielectric layer is fabricated using a reaction product of the carbon/epoxy composition.
Public/Granted literature
- US20100327408A1 CARBON/EPOXY RESIN COMPOSITION, AND CARBON-EPOXY DIELECTRIC FILM PRODUCED BY USING THE SAME Public/Granted day:2010-12-30
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