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US08461669B2 Integrated power converter package with die stacking 有权
集成功率转换器封装,带芯片堆叠

Integrated power converter package with die stacking
摘要:
An integrated circuit for implementing a switch-mode power converter is disclosed. The integrated circuit comprises at least a first semiconductor die having an electrically quiet surface, a second semiconductor die for controlling the operation of said first semiconductor die stacked on said first semiconductor die having said electrically quiet surface and a lead frame structure for supporting said first semiconductor die and electrically coupling said first and second semiconductor dies to external circuitry.
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