发明授权
- 专利标题: Integrated power converter package with die stacking
- 专利标题(中): 集成功率转换器封装,带芯片堆叠
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申请号: US12886350申请日: 2010-09-20
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公开(公告)号: US08461669B2公开(公告)日: 2013-06-11
- 发明人: Eric Yang , Jinghai Zhou , Hunt Hang Jiang
- 申请人: Eric Yang , Jinghai Zhou , Hunt Hang Jiang
- 申请人地址: US CA San Jose
- 专利权人: Monolithic Power Systems, Inc.
- 当前专利权人: Monolithic Power Systems, Inc.
- 当前专利权人地址: US CA San Jose
- 代理机构: Okamoto & Benedicto LLP
- 主分类号: H01L23/52
- IPC分类号: H01L23/52
摘要:
An integrated circuit for implementing a switch-mode power converter is disclosed. The integrated circuit comprises at least a first semiconductor die having an electrically quiet surface, a second semiconductor die for controlling the operation of said first semiconductor die stacked on said first semiconductor die having said electrically quiet surface and a lead frame structure for supporting said first semiconductor die and electrically coupling said first and second semiconductor dies to external circuitry.
公开/授权文献
- US20120068320A1 Integrated Power Converter Package With Die Stacking 公开/授权日:2012-03-22
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