Invention Grant
US08463399B2 Overmolded components for implantable medical leads and related methods
有权
用于可植入医疗线的二次成型组件和相关方法
- Patent Title: Overmolded components for implantable medical leads and related methods
- Patent Title (中): 用于可植入医疗线的二次成型组件和相关方法
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Application No.: US12607806Application Date: 2009-10-28
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Publication No.: US08463399B2Publication Date: 2013-06-11
- Inventor: Jeannette C. Polkinghorne , Joseph A. Cihlar , Mitchell L. Horn-Wyffels , Joseph J. Nelsen , Raymond Gessler , Erin K. Webb , Joseph J. Schachtner , Arienne P. Simon , Andrew De Kock
- Applicant: Jeannette C. Polkinghorne , Joseph A. Cihlar , Mitchell L. Horn-Wyffels , Joseph J. Nelsen , Raymond Gessler , Erin K. Webb , Joseph J. Schachtner , Arienne P. Simon , Andrew De Kock
- Applicant Address: US MN St. Paul
- Assignee: Cardiac Pacemakers, Inc.
- Current Assignee: Cardiac Pacemakers, Inc.
- Current Assignee Address: US MN St. Paul
- Agency: Faegre Baker Daniels LLP
- Main IPC: A61N1/05
- IPC: A61N1/05
Abstract:
The various embodiments disclosed herein relate to medical electrical leads. More specifically, certain embodiments relate to leads having one or more drug-eluting components that are overmolded or otherwise positioned on the lead. Other embodiments relate to leads having one or more patterned surfaces, including some leads with one or more patterned surfaces over which one or more drug-eluting components are positioned. Further implementations relate to leads having one or more overmolded patterned surfaces, including some embodiments in which the overmolded surfaces contain at least one drug-eluting component.
Public/Granted literature
- US20100125320A1 OVERMOLDED COMPONENTS FOR IMPLANTABLE MEDICAL LEADS AND RELATED METHODS Public/Granted day:2010-05-20
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