Invention Grant
- Patent Title: Micro-electromechanical systems (MEMS) structure
- Patent Title (中): 微机电系统(MEMS)结构
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Application No.: US12904169Application Date: 2010-10-14
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Publication No.: US08464589B2Publication Date: 2013-06-18
- Inventor: Chien-Hsing Lee , Tsung-Min Hsieh , Li-Chi Tsao , Jhyy-Cheng Liou
- Applicant: Chien-Hsing Lee , Tsung-Min Hsieh , Li-Chi Tsao , Jhyy-Cheng Liou
- Applicant Address: TW Hsinchu
- Assignee: Solid State System Co., Ltd.
- Current Assignee: Solid State System Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Main IPC: G01L7/08
- IPC: G01L7/08

Abstract:
A MEMS structure includes a substrate, a structural dielectric layer, and a diaphragm. A structural dielectric layer is disposed over the substrate. The diaphragm is held by the structural dielectric layer at a peripheral end. The diaphragm includes multiple trench/ridge rings at a peripheral region surrounding a central region of the diaphragm. A corrugated structure is located at the central region of the diaphragm, surrounded by the trench/indent rings.
Public/Granted literature
- US20120090398A1 MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) STRUCTURE Public/Granted day:2012-04-19
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