Invention Grant
- Patent Title: Seal ring support for backside illuminated image sensor
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Application No.: US13735787Application Date: 2013-01-07
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Publication No.: US08466010B2Publication Date: 2013-06-18
- Inventor: Hsin-Chih Tai , Vincent Venezia , Yin Qian , Duli Mao , Keh-Chiang Ku
- Applicant: Omnivision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor & Zafman LLP
- Main IPC: H01L23/04
- IPC: H01L23/04

Abstract:
A backside illuminated imaging sensor with a seal ring support includes an epitaxial layer having an imaging array formed in a front side of the epitaxial layer. A metal stack is coupled to the front side of the epitaxial layer, wherein the metal stack includes a seal ring formed in an edge region of the imaging sensor. An opening is included that extends from the back side of the epitaxial layer to a metal pad of the seal ring to expose the metal pad. The seal ring support is disposed on the metal pad and within the opening to structurally support the seal ring.
Public/Granted literature
- US20130122637A1 SEAL RING SUPPORT FOR BACKSIDE ILLUMINATED IMAGE SENSOR Public/Granted day:2013-05-16
Information query
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