发明授权
US08466604B2 Vibration actuator module having smaller elastic modulus than vibrated body
失效
振动执行器模块具有比振动体更小的弹性模量
- 专利标题： Vibration actuator module having smaller elastic modulus than vibrated body
- 专利标题（中）： 振动执行器模块具有比振动体更小的弹性模量
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申请号： US12773352申请日： 2010-05-04
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公开(公告)号： US08466604B2公开(公告)日： 2013-06-18
- 发明人: Ki-Suk Woo , Yeon-Ho Son , Su-Young Jung , Dong-Sun Park , Dae-Woong Yun , Kum-Kyung Lee , Ji-Yeoun Jang , Jae-Kyung Kim
- 申请人： Ki-Suk Woo , Yeon-Ho Son , Su-Young Jung , Dong-Sun Park , Dae-Woong Yun , Kum-Kyung Lee , Ji-Yeoun Jang , Jae-Kyung Kim
- 申请人地址： KR Suwon, Gyunggi-Do
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon, Gyunggi-Do
- 代理机构： McDermott Will & Emery LLP
- 优先权： KR10-2009-0116182 20091127
- 主分类号： H01L41/08
- IPC分类号： H01L41/08
摘要：
A vibration actuator module is disclosed. In accordance with an embodiment of the present invention, the vibration actuator module includes a vibrated body, a vibrating plate, which is coupled to the vibrated body and has a smaller elastic modulus than the vibrated body, and a driver, which is coupled to the vibrating plate.
公开/授权文献
- US20110127884A1 VIBRATION ACTUATOR MODULE 公开/授权日：2011-06-02
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