Invention Grant
- Patent Title: Low profile layered coil and cores for magnetic components
- Patent Title (中): 薄型层状线圈和磁性元件芯
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Application No.: US12766227Application Date: 2010-04-23
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Publication No.: US08466764B2Publication Date: 2013-06-18
- Inventor: Robert James Bogert , Yipeng Yan , Frank Anthony Doljack , Hundi Panduranga Kamath
- Applicant: Robert James Bogert , Yipeng Yan , Frank Anthony Doljack , Hundi Panduranga Kamath
- Applicant Address: US TX Houston
- Assignee: Cooper Technologies Company
- Current Assignee: Cooper Technologies Company
- Current Assignee Address: US TX Houston
- Agency: Armstrong Teasdale LLP
- Main IPC: H01F27/02
- IPC: H01F27/02
Abstract:
A low profile magnetic component includes at least one coil layer defining a generally planar coil winding having a center area and a number of turns extending about the center area. A body encloses the coil layer, and is fabricated from one of a dielectric material and a magnetic material. A magnetic core material occupies at least the center area of the coil layer.
Public/Granted literature
- US20100259351A1 LOW PROFILE LAYERED COIL AND CORES FOR MAGNETIC COMPONENTS Public/Granted day:2010-10-14
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