发明授权
- 专利标题: Method for high volume e-beam lithography
- 专利标题(中): 大容量电子束光刻方法
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申请号: US13492408申请日: 2012-06-08
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公开(公告)号: US08468473B1公开(公告)日: 2013-06-18
- 发明人: Hung-Chun Wang , Tzu-Chin Lin , Chia-Chi Lin , Nian-Fuh Cheng , Jeng-Horng Chen , Wen-Chun Huang , Ru-Gun Liu
- 申请人: Hung-Chun Wang , Tzu-Chin Lin , Chia-Chi Lin , Nian-Fuh Cheng , Jeng-Horng Chen , Wen-Chun Huang , Ru-Gun Liu
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Haynes and Boone, LLP
- 主分类号: G06F17/50
- IPC分类号: G06F17/50
摘要:
The present disclosure describes a method of forming a pattern by an electron beam lithography system. The method includes receiving an integrated circuit (IC) design layout data having a polygon and a forbidden pattern, modifying the polygon and the forbidden pattern using an electron proximity correction (EPC) technique, stripping the modified polygon into subfields, converting the stripped polygon to an electron beam writer format data, and writing the electron beam writer formatted polygon onto a substrate by an electron beam writer. Stripping the modified polygon includes finding the modified forbidden pattern as a reference layer, and stitching the modified polygon to avoid stitching the modified forbidden pattern.
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