发明授权
- 专利标题： Paste composition
- 专利标题（中）： 粘贴成分
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申请号： US12769206申请日： 2010-04-28
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公开(公告)号： US08470209B2公开(公告)日： 2013-06-25
- 发明人: Eun Sung Lee , Sang Cheol Park , Won Cheol Jung , Jin Young Bae
- 申请人： Eun Sung Lee , Sang Cheol Park , Won Cheol Jung , Jin Young Bae
- 申请人地址： KR Yongin-si KR Suwon-si
- 专利权人： Samsung SDI Co., Ltd.,Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung SDI Co., Ltd.,Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Yongin-si KR Suwon-si
- 代理机构： Christie, Parker & Hale, LLP
- 优先权： KR10-2006-0056909 20060623
- 主分类号： H01B1/12
- IPC分类号： H01B1/12 ; B82Y30/00
摘要：
A paste composition comprises a dye containing a novel oligomeric compound with improved dispersion performance. The oligomeric compound comprises a tail structure consisting of hydrophilic and hydrophobic blocks and an amine or imidazole head structure. The paste composition can be used to prepare a semiconductor electrode of a solar cell. A semiconductor electrode produced using the paste composition and a solar cell fabricated using the semiconductor electrode exhibit greatly improved power conversion efficiency and superior processability.
公开/授权文献
- US20100207077A1 PASTE COMPOSITION 公开/授权日：2010-08-19
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