发明授权
US08471266B2 Group III nitride semiconductor multilayer structure and production method thereof
有权
III族氮化物半导体多层结构及其制备方法
- 专利标题: Group III nitride semiconductor multilayer structure and production method thereof
- 专利标题(中): III族氮化物半导体多层结构及其制备方法
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申请号: US13493972申请日: 2012-06-11
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公开(公告)号: US08471266B2公开(公告)日: 2013-06-25
- 发明人: Kenzo Hanawa , Yasumasa Sasaki
- 申请人: Kenzo Hanawa , Yasumasa Sasaki
- 申请人地址: JP Aichi-ken
- 专利权人: Toyoda Gosei Co., Ltd.
- 当前专利权人: Toyoda Gosei Co., Ltd.
- 当前专利权人地址: JP Aichi-ken
- 代理机构: Sughrue Mion, PLLC
- 优先权: JP2008-203429 20080806
- 主分类号: H01L33/40
- IPC分类号: H01L33/40
摘要:
According to the present invention, an AlN crystal film seed layer having high crystallinity is combined with selective/lateral growth, whereby a Group III nitride semiconductor multilayer structure more enhanced in crystallinity can be obtained. The Group III nitride semiconductor multilayer structure of the present invention is a Group III nitride semiconductor multilayer structure where an AlN crystal film having a crystal grain boundary interval of 200 nm or more is formed as a seed layer on a C-plane sapphire substrate surface by a sputtering method and an underlying layer, an n-type semiconductor layer, a light-emitting layer and a p-type semiconductor layer, each composed of a Group III nitride semiconductor, are further stacked, wherein regions in which the seed layer is present and is absent are formed on the C-plane sapphire substrate surface and/or regions capable of epitaxial growth and incapable of epitaxial growth are formed in the underlying layer.
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