Invention Grant
- Patent Title: Multi-patterning method
- Patent Title (中): 多图案化方法
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Application No.: US13224486Application Date: 2011-09-02
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Publication No.: US08473873B2Publication Date: 2013-06-25
- Inventor: Chin-Chang Hsu , Ying-Yu Shen , Wen-Ju Yang , Hsiao-Shu Chao , Yi-Kan Cheng
- Applicant: Chin-Chang Hsu , Ying-Yu Shen , Wen-Ju Yang , Hsiao-Shu Chao , Yi-Kan Cheng
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Agent Steven E. Koffs
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method includes receiving data representing a layout of a DPT-layer of an integrated circuit generated by a place and route tool. The layout includes a plurality of polygons to be formed in the DPT-layer by a multi-patterning process. First and second ones of the plurality of polygons to be formed using first and second photomasks, respectively are identified. Any intervening polygons along a first path connecting the first polygon to the second polygon, and separator regions between adjacent polygons along the first path are identified. The separator regions have sizes less than a minimum threshold distance between polygons formed on the first photomask. The separator regions are counted. A multi-patterning conflict is identified, if the count of separator regions is even, prior to assigning all remaining ones of the plurality of polygons to the first or second masks.
Public/Granted literature
- US20130061186A1 MULTI-PATTERNING METHOD Public/Granted day:2013-03-07
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