Invention Grant
- Patent Title: Method of controlling a thickness of a sheet formed from a melt
- Patent Title (中): 控制由熔体形成的片材的厚度的方法
-
Application No.: US12539125Application Date: 2009-08-11
-
Publication No.: US08475591B2Publication Date: 2013-07-02
- Inventor: Peter L. Kellerman , Fredrick Carlson , Frank Sinclair
- Applicant: Peter L. Kellerman , Fredrick Carlson , Frank Sinclair
- Applicant Address: US MA Gloucester
- Assignee: Varian Semiconductor Equipment Associates, Inc.
- Current Assignee: Varian Semiconductor Equipment Associates, Inc.
- Current Assignee Address: US MA Gloucester
- Main IPC: C30B15/20
- IPC: C30B15/20

Abstract:
A method and apparatus for forming a sheet are disclosed. A melt is cooled and a sheet is formed on the melt. This sheet has a first thickness. The sheet is then thinned from the first thickness to a second thickness using, for example, a heater or the melt. The cooling may be configured to allow solutes to be trapped in a region of the sheet and this particular sheet may be thinned and the solutes removed. The melt may be, for example, silicon, silicon and germanium, gallium, or gallium nitride.
Public/Granted literature
- US20100038826A1 SHEET THICKNESS CONTROL Public/Granted day:2010-02-18
Information query
IPC分类: