发明授权
- 专利标题： Method for forming electrical traces on substrate
- 专利标题（中）： 在基板上形成电迹线的方法
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申请号： US12570040申请日： 2009-09-30
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公开(公告)号： US08475867B2公开(公告)日： 2013-07-02
- 发明人: Yao-Wen Bai , Cheng-Hsien Lin
- 申请人： Yao-Wen Bai , Cheng-Hsien Lin
- 申请人地址： CN Shenzhen TW Tayuan, Taoyuan
- 专利权人： FuKui Precision Component (Shenzhen) Co., Ltd.,Zhen Ding Technology Co., Ltd.
- 当前专利权人： FuKui Precision Component (Shenzhen) Co., Ltd.,Zhen Ding Technology Co., Ltd.
- 当前专利权人地址： CN Shenzhen TW Tayuan, Taoyuan
- 代理机构： Altis Law Group, Inc.
- 优先权： CN200810305777 20081127
- 主分类号： C23C18/54
- IPC分类号： C23C18/54 ; C23C18/38
摘要：
A method for forming electrical traces on a substrate includes the steps of: providing a substrate; printing an ink pattern using an ink on the substrate, the ink including a aqueous medium containing silver ions and a heat sensitive reducing agent; heating the ink pattern to reduce silver ions into silver particles thereby forming an semi-finished traces; and forming a metal overcoat on the semi-finished traces by electroless plating thereby obtaining patterned electrical traces.
公开/授权文献
- US20100129532A1 METHOD FOR FORMING ELECTRICAL TRACES ON SUBSTRATE 公开/授权日：2010-05-27
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