Invention Grant
- Patent Title: Apparatus for applying electrode mixture paste with homogeneous distribution of coating amount of electrode mixture paste
- Patent Title (中): 用于涂覆电极混合物浆料涂布量均匀分布的装置
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Application No.: US13365763Application Date: 2012-02-03
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Publication No.: US08475876B2Publication Date: 2013-07-02
- Inventor: Kimihiro Imamura , Hiroyuki Usui , Tadakazu Seto
- Applicant: Kimihiro Imamura , Hiroyuki Usui , Tadakazu Seto
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2005-126292 20050425
- Main IPC: H01M4/10
- IPC: H01M4/10 ; H01M4/08 ; H01M4/64

Abstract:
An electrode mixture paste is applied on both sides of a strip of core material as it runs along its lengthwise direction, and the coating thickness of the paste is adjusted as the core material coated with the paste passes through a gap between a pair of scraper tools. Tips provided to the scraper tools scrape off the paste to form a paste-coated portion of a predetermined width. The electrode mixture paste scraped off with the tips is returned through recesses on the upstream side of the tips in the running direction of the core material, so as to prevent the phenomenon where the coating thickness is increased at both side edges of the paste-coated portion. Thus, a method for applying electrode mixture paste is realized that can prevent the phenomenon where the coating thickness is increased at both side edges of the paste-coated portion.
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