Invention Grant
- Patent Title: Flex-rigid wiring board and method of manufacturing the same
- Patent Title (中): 挠性刚性接线板及其制造方法
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Application No.: US13238429Application Date: 2011-09-21
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Publication No.: US08476531B2Publication Date: 2013-07-02
- Inventor: Michimasa Takahashi , Masakazu Aoyama
- Applicant: Michimasa Takahashi , Masakazu Aoyama
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd
- Current Assignee: Ibiden Co., Ltd
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer covering the flexible board and the non-flexible substrate and exposing one or more portions of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.
Public/Granted literature
- US20120008290A1 FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2012-01-12
Information query
