-
公开(公告)号：US08404978B2
公开(公告)日：2013-03-26
申请号：US12873944
申请日：2010-09-01
IPC分类号： H05K1/03
CPC分类号： H05K3/4691 , H05K2201/0391 , H05K2201/09127 , H05K2201/09854 , H05K2203/308 , Y10T29/49124
摘要： A flex-rigid wiring board including an insulative substrate having a wiring layer which is formed on the insulative substrate and includes a conductor, a flexible wiring board positioned beside the insulative substrate and having a wiring layer, the wiring layer of the flexible wiring board including a conductor and being contained inside the flexible wiring board, and a first insulation layer positioned on the insulative substrate and the flexible wiring board such that a portion of the flexible wiring board is left exposed from the first insulation layer. The first insulation layer has a wiring layer which is formed on the first insulation layer and includes a conductor. The wiring layer of the first insulation layer has a thickness which is formed thicker than a thickness of the wiring layer of the flexible wiring board and a thickness of the wiring layer of the insulative substrate.
摘要翻译： 一种柔性刚性布线板，包括具有布线层的绝缘基板，所述布线层形成在所述绝缘基板上并且包括导体，柔性布线板位于所述绝缘基板的旁边并具有布线层，所述柔性布线板的布线层包括 导体，并且被容纳在柔性布线板内部;以及第一绝缘层，其位于绝缘基板和柔性布线板上，使得柔性布线板的一部分从第一绝缘层露出。 第一绝缘层具有形成在第一绝缘层上并包括导体的布线层。 第一绝缘层的布线层的厚度比柔性布线基板的布线层的厚度和绝缘基板的布线层的厚度厚。
-
公开(公告)号：US08353103B2
公开(公告)日：2013-01-15
申请号：US12555305
申请日：2009-09-08
申请人： Yasuhiro Watanabe , Michimasa Takahashi , Masakazu Aoyama , Takenobu Nakamura , Hiroyuki Yanagisawa
发明人： Yasuhiro Watanabe , Michimasa Takahashi , Masakazu Aoyama , Takenobu Nakamura , Hiroyuki Yanagisawa
CPC分类号： H05K1/113 , H01L23/49816 , H01L23/49822 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01025 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/15174 , H01L2924/15311 , H01L2924/19105 , H01L2924/19106 , H05K1/114 , H05K3/243 , H05K3/28 , H05K3/282 , H05K3/4614 , H05K2201/0391 , H05K2201/10674 , H05K2203/0574 , Y10T29/49117 , Y10T29/49124 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156 , Y10T29/49204 , H01L2224/0401
摘要： A method of manufacturing multilayer printed wiring hoard in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. In the inventive method, no corrosion resistant layer is formed on a solder pad on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, a land in which the corrosion resistant layer is formed by the method is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.
摘要翻译： 可以提高制造多层印刷布线的方法，其中通过提高可靠性而获得电连接性和功能性，特别是降低测试的可靠性。 在本发明的方法中，在要安装部件的焊料焊盘上没有形成耐腐蚀层以获得柔性。 因此，如果在相关产品掉线时从外部接收到冲击，则可以缓冲影响，以保护所安装的组件不被移除。 另一方面，即使构成操作键的碳柱重复接触，通过该方法形成耐腐蚀层的区域也不太可能发生接触不良。
-
公开(公告)号：US08035983B2
公开(公告)日：2011-10-11
申请号：US12144691
申请日：2008-06-24
IPC分类号： H05K1/11
CPC分类号： H05K3/4691 , H05K1/0366 , H05K1/0373 , H05K3/0035 , H05K3/0052 , H05K3/4652 , H05K2201/0187 , H05K2201/0209 , H05K2201/096 , H05K2201/09845 , H05K2203/1536 , Y10T29/49124 , Y10T29/49126 , Y10T29/49165
摘要： A wiring board and method of forming a wiring board. The wiring board includes a first substrate and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond at least one edge of the second substrate. At least one of the base substrate, the first substrate or the second substrate comprises pliable resin, and at least one other of the base substrate, the first substrate or the second substrate comprises an inorganic filler.
摘要翻译： 布线基板及布线基板的形成方法。 布线板包括第一基板和具有比第一基板的安装面积小的安装面积的第二基板。 基底衬底层压在第一衬底和第二衬底之间，使得第一衬底延伸超过第二衬底的至少一个边缘。 基底衬底，第一衬底或第二衬底中的至少一个包括柔韧树脂，并且基底衬底，第一衬底或第二衬底中的至少一个包括无机填料。
-
4.发明授权公开(公告)号：US07626829B2
公开(公告)日：2009-12-01
申请号：US11250531
申请日：2005-10-17
申请人： Yasuhiro Watanabe , Michimasa Takahashi , Masakazu Aoyama , Takenobu Nakamura , Hiroyuki Yanagisawa
发明人： Yasuhiro Watanabe , Michimasa Takahashi , Masakazu Aoyama , Takenobu Nakamura , Hiroyuki Yanagisawa
IPC分类号： H05K7/10
CPC分类号： H05K1/113 , H01L23/49816 , H01L23/49822 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01025 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/15174 , H01L2924/15311 , H01L2924/19105 , H01L2924/19106 , H05K1/114 , H05K3/243 , H05K3/28 , H05K3/282 , H05K3/4614 , H05K2201/0391 , H05K2201/10674 , H05K2203/0574 , Y10T29/49117 , Y10T29/49124 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156 , Y10T29/49204 , H01L2224/0401
摘要： This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder pad 60B on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, land 60A in which the corrosion resistant layer is formed is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.
摘要翻译： 本发明提供了一种通过提高可靠性而获得电连接性和功能性的多层印刷线路板，特别是可提高落下试验的可靠性。 在要安装部件的焊料垫60B上没有形成耐腐蚀层，以获得柔性。 因此，如果在相关产品掉线时从外部接收到冲击，则可以缓冲影响，以保护所安装的组件不被移除。 另一方面，即使构成操作键的碳柱重复接触，也可能不形成耐腐蚀层的焊盘60A不会发生接触故障。
-
公开(公告)号：US20090038836A1
公开(公告)日：2009-02-12
申请号：US12146279
申请日：2008-06-25
CPC分类号： H05K3/4691 , H01L2224/05001 , H01L2224/05023 , H01L2224/05568 , H01L2224/16227 , H01L2224/16235 , H01L2924/00014 , H05K1/0366 , H05K1/148 , H05K3/0052 , H05K3/4602 , H05K3/4652 , H05K2201/0187 , H05K2201/0191 , H05K2201/0209 , H05K2201/09509 , H05K2201/09563 , H05K2201/096 , H05K2201/09845 , H05K2203/1536 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , H01L2224/05599 , H01L2224/05099
摘要： A wiring board assembly and a method of making a wiring board assembly. The wiring board assembly includes a first wiring board having a first substrate, a non-pliable second substrate having a smaller mounting area than a mounting area of the first substrate and a base substrate laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate. At least one via formed in at least one of the first substrate or the second substrate. A second wiring board includes a pliable member connecting the first wiring board to the second wiring board.
摘要翻译： 一种接线板组件及其制造方法。 布线基板组件包括：第一布线板，具有第一基板，非柔性第二基板，其安装面积小于第一基板的安装面积;以及基板基板，层压在第一基板和第二基板之间， 衬底延伸超过第二衬底的边缘。 至少一个通孔形成在第一基板或第二基板中的至少一个中。 第二布线板包括将第一布线板连接到第二布线板的柔性构件。
-
公开(公告)号：US08925194B2
公开(公告)日：2015-01-06
申请号：US13219169
申请日：2011-08-26
CPC分类号： H05K3/4691 , H05K1/0218 , H05K3/0035 , H05K3/4652 , H05K3/4664 , H05K2201/0187 , H05K2201/0715 , H05K2201/09127 , H05K2201/09509 , Y10T29/49124 , Y10T29/49165
摘要： A method of manufacturing a flex-rigid wiring board includes disposing a non-flexible substrate and a flexible board side by side in the horizontal direction of the substrate and board such that an end of the substrate is positioned adjacent to an end of the board and forms boundary between the board and the substrate with respect to the end of the board, covering the boundary between the board and the substrate with an insulating layer such that the insulating layer is positioned on the board and the substrate across the boundary, forming a second conductor pattern on the insulating layer, forming a via hole which passes through the insulating layer and reaches a first conductor pattern of the board, and plating the via hole such that a via conductor connecting the first and second patterns. The flexible board includes a flexible substrate and the first pattern formed over the substrate.
摘要翻译： 制造柔性刚性布线板的方法包括在基板和板的水平方向上并排设置非柔性基板和柔性基板，使得基板的端部邻近板的端部定位， 在板和基板之间形成相对于板的端部的边界，用绝缘层覆盖板和基板之间的边界，使得绝缘层位于板上并且基板跨越边界，形成第二个 形成绝缘层上的导体图案，形成穿过绝缘层并到达板的第一导体图形的通孔，并且对通孔进行电镀，使得连接第一和第二图案的通孔导体。 柔性板包括柔性基板和形成在基板上的第一图案。
-
公开(公告)号：US08493747B2
公开(公告)日：2013-07-23
申请号：US12949078
申请日：2010-11-18
IPC分类号： H05K1/11
CPC分类号： H05K3/4691 , H05K2201/09827 , H05K2201/09845 , Y10T29/49124 , Y10T29/49128
摘要： A flex-rigid wiring board including an insulative substrate, a flexible wiring board positioned beside the insulative substrate, an insulation layer positioned over the insulative substrate and the flexible wiring board and exposing a portion of the flexible wiring board, and a wiring layer made of a conductor and formed on the insulation layer. The insulation layer has a tapered portion which becomes thinner toward an end surface of the insulation layer in the direction of the portion of the flexible wiring board exposed by the insulation layer. The wiring layer has a sloping portion formed on the tapered portion of the insulation layer.
摘要翻译： 一种柔性刚性布线板，包括绝缘基板，位于绝缘基板旁边的柔性布线板，位于绝缘基板和柔性布线板之上的绝缘层，并使柔性布线板的一部分露出，并且布线层由 导体并形成在绝缘层上。 绝缘层具有锥形部分，其在由绝缘层暴露的柔性线路板的部分的方向上朝向绝缘层的端面变薄。 布线层具有形成在绝缘层的锥形部分上的倾斜部分。
-
公开(公告)号：US08481424B2
公开(公告)日：2013-07-09
申请号：US13243112
申请日：2011-09-23
IPC分类号： H05K3/00
CPC分类号： H01L23/48 , H01L2924/0002 , H05K1/115 , H05K3/00 , H05K3/4602 , H05K3/4652 , H05K2201/0352 , H05K2201/0394 , H05K2201/09563 , H05K2201/096 , H05K2201/09709 , H05K2201/09827 , Y10T29/49124 , H01L2924/00
摘要： A method for manufacturing a multilayer printed wiring board including forming a multilayer printed wiring board structure comprising first and second buildup portions, the first buildup portion including insulating layers, conductor layers and first viaholes electrically connecting the conductor layers through the insulation layers such that the first viaholes are formed in the insulating layers, respectively, the second buildup portion including insulating layers, conductor layers and second viaholes electrically connecting the conductor layers through the insulation layers such that the first viaholes are tapered toward the second viaholes, and the second via holes are tapered toward the first viaholes. The viaholes are formed by plating openings formed after lamination of respective ones of the insulating layers of the buildup portions, and each insulating layer in the buildup portions is about 100 μm or less in thickness.
摘要翻译： 一种制造多层印刷线路板的方法，包括形成包括第一和第二积累部分的多层印刷线路板结构，所述第一累积部分包括绝缘层，导体层和通过绝缘层将导体层电连接的第一通孔，使得第一 分别在绝缘层中形成通孔，第二累积部分包括绝缘层，导体层和第二通孔，其通过绝缘层电连接导体层，使得第一通孔朝向第二通孔逐渐变细，第二通孔为 朝向第一通孔逐渐变细。 通孔由叠层后的积层部分的绝缘层各自形成的电镀开口形成，而积层部的绝缘层的厚度为100μm左右。
-
公开(公告)号：US08461459B2
公开(公告)日：2013-06-11
申请号：US12894777
申请日：2010-09-30
IPC分类号： H05K1/00
CPC分类号： H05K3/4691 , H05K2201/09127 , H05K2201/09536 , H05K2203/308 , Y10T29/49124
摘要： A flex-rigid wiring board includes an insulative substrate, a flexible connected body positioned beside the insulative substrate and including multiple flexible wiring boards, and an insulation layer positioned over the insulative substrate and the flexible connected body and having a portion exposing a portion of the flexible connected body. The flexible wiring boards include a double-sided flexible wiring board having a conductive layer on one surface of the double-sided flexible wiring board and a conductive layer on the opposite surface of the double-sided flexible wiring board. The flexible connected body has a conductor on one side of the flexible connected body, a conductor on the opposite side of the flexible connected body, and a through-hole conductor electrically connecting the conductors of the flexible connected body. The through-hole conductor is penetrating from one side through the opposite side of the flexible wiring boards.
摘要翻译： 柔性刚性布线板包括绝缘基板，位于绝缘基板旁边的柔性连接体，并且包括多个柔性布线板，以及位于绝缘基板和柔性连接体上方的绝缘层，并且具有暴露一部分 柔性连接体。 柔性布线板包括双面柔性布线板，该双面柔性布线板在双面柔性布线板的一个表面上具有导电层，在双面柔性布线板的相对表面上具有导电层。 柔性连接体在柔性连接体的一侧具有导体，在柔性连接体的相对侧上具有导体，以及电连接柔性连接体的导体的通孔导体。 通孔导体从一侧穿过柔性布线板的相对侧。
-
公开(公告)号：US08212363B2
公开(公告)日：2012-07-03
申请号：US12819805
申请日：2010-06-21
IPC分类号： H01L23/48
CPC分类号： H01L23/48 , H01L2924/0002 , H05K1/115 , H05K3/00 , H05K3/4602 , H05K3/4652 , H05K2201/0352 , H05K2201/0394 , H05K2201/09563 , H05K2201/096 , H05K2201/09709 , H05K2201/09827 , Y10T29/49124 , H01L2924/00
摘要： A multilayer printed wiring board including insulating layers, conductor layers stacked alternately over the insulating layers, respectively, and viaholes formed in the insulation layers and electrically connecting the conductor layers through the insulation layers. The viaholes include a first group of viaholes and a second group of viaholes. The viaholes in the first group are tapered toward the viaholes in the second group, and the viaholes in the second group are tapered toward the viaholes in the first group. The viaholes in the first group and the the viaholes in the second group are formed in the insulating layers, respectively, and the viaholes are formed by plating openings formed after lamination of respective ones of the insulating layers, and each of the insulating layers is about 100 μm or less in thickness.
摘要翻译： 一种多层印刷布线板，分别包括绝缘层，交替地层叠在绝缘层上的导体层和形成在绝缘层中的通孔，并通过绝缘层电连接导体层。 通孔包括第一组通孔和第二组通孔。 第一组中的通孔朝向第二组中的通孔逐渐变细，第二组中的通孔在第一组中朝向通孔逐渐变细。 第一组中的通孔和第二组中的通孔分别形成在绝缘层中，并且通孔由叠层各绝缘层之后形成的电镀开口形成，并且每个绝缘层为约 厚度为100μm以下。
-
-
-
-
-
-
-
-
-
搜索结果
67 条记录 (耗时 0.04 秒)
