Invention Grant
- Patent Title: Multilayered printed wiring board and method for manufacturing the same
- Patent Title (中): 多层印刷线路板及其制造方法
-
Application No.: US12926311Application Date: 2010-11-09
-
Publication No.: US08476535B2Publication Date: 2013-07-02
- Inventor: Takahiro Sahara , Atsushi Kobayashi , Masahiko Igaue , Kiyoshi Takeuchi
- Applicant: Takahiro Sahara , Atsushi Kobayashi , Masahiko Igaue , Kiyoshi Takeuchi
- Applicant Address: JP Tokyo
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JPP2006-205640 20060728
- Main IPC: H05K1/16
- IPC: H05K1/16
Abstract:
A multilayered printed wiring board includes a flexible wiring board with wiring layers on both main surfaces thereof; a rigid wiring board with wiring layers on both main surfaces thereof and formed opposite to the flexible wiring board under the condition that an area of the main surface of the rigid wiring board is smaller than an area of the main surface of the flexible wiring board; and an electric/electronic component embedded in the rigid wiring board.
Public/Granted literature
- US20110061903A1 Multilayered printed wiring board and method for manufacturing the same Public/Granted day:2011-03-17
Information query
