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公开(公告)号：US20080049405A1
公开(公告)日：2008-02-28
申请号：US11878923
申请日：2007-07-27
CPC分类号： H05K1/183 , H01L2224/16225 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/15153 , H01L2924/15313 , H01L2924/19105 , H01L2924/30107 , H05K1/0298 , H05K1/0306 , H05K3/284 , H05K3/4069 , H05K3/4614 , H05K3/4697 , H05K2201/10515 , H05K2201/10636 , H05K2203/049 , H05K2203/061 , H05K2203/063 , Y02P70/611 , Y10T29/49126 , H01L2924/00 , H01L2224/0401
摘要： A multilayered printed wiring board includes a plurality of insulating layers; a plurality of wiring layers which are located between the corresponding adjacent insulating layers; and a plurality of interlayer connection conductors for electrically connecting the wiring layers through the insulating layers; wherein a cavity is formed through one or more of the insulating layers so as to insert a first electric/electronic component and an area for embedding a second electric/electronic component is defined for the insulating layers.
摘要翻译： 多层印刷电路板包括多个绝缘层; 位于相应的相邻绝缘层之间的多个布线层; 以及多个层间连接导体，用于通过绝缘层电连接布线层; 其中通过一个或多个所述绝缘层形成空腔以插入第一电/电子部件，并且为所述绝缘层限定用于嵌入第二电/电子部件的区域。
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公开(公告)号：US08942003B2
公开(公告)日：2015-01-27
申请号：US13766809
申请日：2013-02-14
CPC分类号： H05K1/183 , H01L2224/16225 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/15153 , H01L2924/15313 , H01L2924/19105 , H01L2924/30107 , H05K1/0298 , H05K1/0306 , H05K3/284 , H05K3/4069 , H05K3/4614 , H05K3/4697 , H05K2201/10515 , H05K2201/10636 , H05K2203/049 , H05K2203/061 , H05K2203/063 , Y02P70/611 , Y10T29/49126 , H01L2924/00 , H01L2224/0401
摘要： A multilayered printed wiring board includes a plurality of insulating layers; a plurality of wiring layers which are located between the corresponding adjacent insulating layers; and a plurality of interlayer connection conductors for electrically connecting the wiring layers through the insulating layers; wherein a cavity is formed through one or more of the insulating layers so as to insert a first electric/electronic component and an area for embedding a second electric/electronic component is defined for the insulating layers.
摘要翻译： 多层印刷电路板包括多个绝缘层; 位于相应的相邻绝缘层之间的多个布线层; 以及多个层间连接导体，用于通过绝缘层电连接布线层; 其中通过一个或多个所述绝缘层形成空腔以插入第一电/电子部件，并且为所述绝缘层限定用于嵌入第二电/电子部件的区域。
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公开(公告)号：US08400776B2
公开(公告)日：2013-03-19
申请号：US11878923
申请日：2007-07-27
IPC分类号： H05K1/16
CPC分类号： H05K1/183 , H01L2224/16225 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/15153 , H01L2924/15313 , H01L2924/19105 , H01L2924/30107 , H05K1/0298 , H05K1/0306 , H05K3/284 , H05K3/4069 , H05K3/4614 , H05K3/4697 , H05K2201/10515 , H05K2201/10636 , H05K2203/049 , H05K2203/061 , H05K2203/063 , Y02P70/611 , Y10T29/49126 , H01L2924/00 , H01L2224/0401
摘要： A multilayered printed wiring board includes a plurality of insulating layers; a plurality of wiring layers which are located between the corresponding adjacent insulating layers; and a plurality of interlayer connection conductors for electrically connecting the wiring layers through the insulating layers; wherein a cavity is formed through one or more of the insulating layers so as to insert a first electric/electronic component and an area for embedding a second electric/electronic component is defined for the insulating layers.
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公开(公告)号：US20110061903A1
公开(公告)日：2011-03-17
申请号：US12926311
申请日：2010-11-09
CPC分类号： H05K1/186 , H05K3/4069 , H05K3/4614 , H05K3/4647 , H05K3/4691 , H05K2201/10636 , H05K2203/061 , H05K2203/063 , Y02P70/611 , Y10T29/49126
摘要： A multilayered printed wiring board includes a flexible wiring board with wiring layers on both main surfaces thereof; a rigid wiring board with wiring layers on both main surfaces thereof and formed opposite to the flexible wiring board under the condition that an area of the main surface of the rigid wiring board is smaller than an area of the main surface of the flexible wiring board; and an electric/electronic component embedded in the rigid wiring board.
摘要翻译： 多层印刷线路板包括：在其两个主表面上具有布线层的柔性布线板; 在刚性布线板的主表面的面积小于柔性布线板的主表面的区域的条件下，在两个主表面上布置有与柔性布线板相对的布线层的刚性布线板; 以及嵌入刚性布线板中的电气/电子部件。
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公开(公告)号：US20080047737A1
公开(公告)日：2008-02-28
申请号：US11878660
申请日：2007-07-26
CPC分类号： H05K1/186 , H05K3/4069 , H05K3/4614 , H05K3/4647 , H05K3/4691 , H05K2201/10636 , H05K2203/061 , H05K2203/063 , Y02P70/611 , Y10T29/49126
摘要： A multilayered printed wiring board includes a flexible wiring board with wiring layers on both main surfaces thereof; a rigid wiring board with wiring layers on both main surfaces thereof and formed opposite to the flexible wiring board under the condition that an area of the main surface of the rigid wiring board is smaller than an area of the main surface of the flexible wiring board; and an electric/electronic component embedded in the rigid wiring board.
摘要翻译： 多层印刷线路板包括：在其两个主表面上具有布线层的柔性布线板; 在刚性布线板的主表面的面积小于柔性布线板的主表面的区域的条件下，在两个主表面上布置有与柔性布线板相对的布线层的刚性布线板; 以及嵌入刚性布线板中的电气/电子部件。
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公开(公告)号：US20130220686A1
公开(公告)日：2013-08-29
申请号：US13766809
申请日：2013-02-14
CPC分类号： H05K1/183 , H01L2224/16225 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/15153 , H01L2924/15313 , H01L2924/19105 , H01L2924/30107 , H05K1/0298 , H05K1/0306 , H05K3/284 , H05K3/4069 , H05K3/4614 , H05K3/4697 , H05K2201/10515 , H05K2201/10636 , H05K2203/049 , H05K2203/061 , H05K2203/063 , Y02P70/611 , Y10T29/49126 , H01L2924/00 , H01L2224/0401
摘要： A multilayered printed wiring board includes a plurality of insulating layers; a plurality of wiring layers which are located between the corresponding adjacent insulating layers; and a plurality of interlayer connection conductors for electrically connecting the wiring layers through the insulating layers; wherein a cavity is formed through one or more of the insulating layers so as to insert a first electric/electronic component and an area for embedding a second electric/electronic component is defined for the insulating layers.
摘要翻译： 多层印刷电路板包括多个绝缘层; 位于相应的相邻绝缘层之间的多个布线层; 以及多个层间连接导体，用于通过绝缘层电连接布线层; 其中通过一个或多个所述绝缘层形成空腔以插入第一电/电子部件，并且为所述绝缘层限定用于嵌入第二电/电子部件的区域。
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公开(公告)号：US08476535B2
公开(公告)日：2013-07-02
申请号：US12926311
申请日：2010-11-09
IPC分类号： H05K1/16
CPC分类号： H05K1/186 , H05K3/4069 , H05K3/4614 , H05K3/4647 , H05K3/4691 , H05K2201/10636 , H05K2203/061 , H05K2203/063 , Y02P70/611 , Y10T29/49126
摘要： A multilayered printed wiring board includes a flexible wiring board with wiring layers on both main surfaces thereof; a rigid wiring board with wiring layers on both main surfaces thereof and formed opposite to the flexible wiring board under the condition that an area of the main surface of the rigid wiring board is smaller than an area of the main surface of the flexible wiring board; and an electric/electronic component embedded in the rigid wiring board.
摘要翻译： 多层印刷线路板包括：在其两个主表面上具有布线层的柔性布线板; 在刚性布线板的主表面的面积小于柔性布线板的主表面的区域的条件下，在两个主表面上布置有与柔性布线板相对的布线层的刚性布线板; 以及嵌入刚性布线板中的电气/电子部件。
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