Invention Grant
- Patent Title: Vertical-type semiconductor device and method of manufacturing the same
- Patent Title (中): 立式半导体器件及其制造方法
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Application No.: US12588270Application Date: 2009-10-09
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Publication No.: US08476713B2Publication Date: 2013-07-02
- Inventor: Seung-Jun Lee , Woonkyung Lee
- Applicant: Seung-Jun Lee , Woonkyung Lee
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2008-0098896 20081009
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L21/336

Abstract:
A vertical-type semiconductor device includes a semiconductor substrate having a cell region and a peripheral circuit region, a wordline structure on the cell region of the semiconductor substrate, the wordline structure including a plurality of wordlines stacked on top of each other, a semiconductor structure through the wordline structure, a gate dielectric between the wordline structure and the semiconductor structure, and a dummy wordline structure on the peripheral circuit region, the dummy wordline structure having a vertical structure and including same components as the wordline structure.
Public/Granted literature
- US20100090286A1 Vertical-type semiconductor device and method of manufacturing the same Public/Granted day:2010-04-15
Information query
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