发明授权
US08476750B2 Printed circuit board having embedded dies and method of forming same
有权
具有嵌入式模具的印刷电路板及其形成方法
- 专利标题： Printed circuit board having embedded dies and method of forming same
- 专利标题（中）： 具有嵌入式模具的印刷电路板及其形成方法
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申请号： US12634965申请日： 2009-12-10
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公开(公告)号： US08476750B2公开(公告)日： 2013-07-02
- 发明人: Fifin Sweeney , Jason R. Gonzalez
- 申请人： Fifin Sweeney , Jason R. Gonzalez
- 申请人地址： US CA San Diego
- 专利权人： QUALCOMM Incorporated
- 当前专利权人： QUALCOMM Incorporated
- 当前专利权人地址： US CA San Diego
- 代理商 Sam Talpalatsky; Nicholas J. Pauley; Joseph Agusta
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L21/98 ; H01L23/52
摘要：
A package includes a printed circuit board (PCB) having a first side and a second side and a thickness between the first side and the second side and a stacked die including a top die mounted on a bottom die, the bottom die being at least partially embedded in the PCB. Also a method of forming a package that includes forming an opening in a top surface of the PCB layer, placing a stacked die including a top die stacked on a bottom die into the opening, laminating the PCB layer to form a laminate layer, and forming an electrical connection with the stacked die.